Lens driving apparatus, and camera module and optical device including same

ABSTRACT

One embodiment includes: a housing; a bobbin arranged in the housing so as to mount a lens therein; a magnet arranged in the housing; a first coil, which is arranged in the bobbin and moves in the optical axial direction according to an interaction with the magnet; an elastic member coupled with the bobbin and the housing; a second coil to which a first drive signal is applied, and moving the housing in a direction perpendicular to the optical axial direction according to the interaction with the magnet; a location sensor for sensing the strength of the magnetic field of the magnet according to the movement of the housing; and a third coil to which a second drive signal is applied, and is arranged in correspondence with the location sensor, wherein a first magnetic field, of the second coil, which is generated by the first drive signal, and a second magnetic field, of the third coil, which is generated by the second drive signal, are generated in directions offsetting each other.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of co-pending U.S. patent applicationSer. No. 16/085,434 filed on Sep. 14, 2018, which is the National Phaseof PCT International Application No. PCT/KR2017/002834, filed on Mar.16, 2017, which claims priority under 35 U.S.C. 119(a) to PatentApplication Nos. 10-2016-0031871, filed in the Republic of Korea on Mar.17, 2016 and 10-2016-0035737, filed in the Republic of Korea on Mar. 25,2016, all of which are hereby expressly incorporated by reference intothe present application.

TECHNICAL FIELD

Embodiments relate to a lens moving apparatus and to a camera module andan optical device each including the same.

BACKGROUND ART

Technology of a voice coil motor (VCM), which is used in existinggeneral camera modules, is difficult to apply to a micro-scale,low-power camera module, and studies related thereto have been activelyconducted.

The demand for electronic products, such as a smartphone and a cellularphone equipped with a camera, is increasing. The trend is for a camerafor a cellular phone to become high-resolution and miniaturized, and theassociated actuator is correspondingly developed so as to realizeminiaturization, a large aperture and multiple functions. In order torealize a high-resolution camera for a cellular phone, there are demandsfor increased performance of the camera for a cellular phone and foradditional functions, such as autofocusing, reduction in shaking of ashutter, zooming and the like.

DISCLOSURE Technical Problem

The embodiments provide a lens moving apparatus, which is capable ofreducing the influence of an induction magnetic field of an OIS coil onan OIS position sensor and of ensuring the stability of OIS feedbackcontrol and reliability of handshake correction, and to a camera moduleand an optical device each including the same.

Technical Solution

A lens moving apparatus according to an embodiment includes a housing; abobbin disposed in the housing for mounting of a lens; a magnet disposedon the housing; a first coil disposed on the bobbin, the first coilbeing moved in an optical-axis direction via interaction with themagnet; an elastic member coupled to the bobbin and the housing; asecond coil, to which a first drive signal is applied, the second coilmoving the housing in a direction perpendicular to the optical-axisdirection via interaction with the magnet; a position sensor fordetecting the intensity of a magnetic field of the magnet depending onmovement of the housing; and a third coil, to which a second drivesignal is applied and which is disposed so as to correspond to theposition sensor, wherein a first magnetic field of the second coil,which is generated in response to the first drive signal, and a secondmagnetic field of the third coil, which is generated in response to thesecond drive signal, are directed so as to counteract each other.

The lens moving apparatus may further include a circuit board disposedunder the housing and providing the first drive signal and the seconddrive signal, wherein the third coil is provided at the circuit board.

The second coil may be disposed on the circuit board, and the positionsensor may be disposed under the circuit board.

Each of the second coil and the third coil may be configured to have aloop shape, which is wound clockwise or counterclockwise about theoptical-axis, and a number of times the third coil is wound may besmaller than a number of times the second coil is wound.

At least part of the third coil may overlap the position sensor in theoptical-axis direction.

Intensity of the second magnetic field may be smaller than intensity ofthe first magnetic field.

The third coil may include: a first wire with one end connected to oneterminal of the circuit board; a second wire with one end connected toanother terminal of the circuit board; and a loop portion connectedbetween the other end of the first wire and the other end of the secondwire and having a loop shape.

A point at which the other end of the first wire is connected to one endof the loop portion and a point at which the other end of the secondwire is connected to the other end of the loop portion may be spacedapart from each other by a predetermined distance.

The housing may include a protrusion projecting upwards from an uppersurface thereof and positioned outside the upper elastic member, whereinthe protrusion overlaps the upper elastic member in the directionperpendicular to the optical-axis.

The housing may further include an upper stopper projecting upwards fromthe upper surface thereof and positioned inside the upper stopper,wherein an upper end of the protrusion is lower than an upper end of theupper stopper but higher than the upper elastic member, and wherein atleast part of the upper elastic member is positioned between the upperstopper and the protrusion.

Advantageous Effects

Embodiments are capable of reducing the influence of an inductionmagnetic field of an OIS coil on an OIS position sensor and of ensuringthe stability of OIS feedback control and reliability of handshakecorrection.

DESCRIPTION OF DRAWINGS

FIG. 1 is an exploded perspective view of a lens moving apparatus;

FIG. 2 is an assembled perspective view illustrating the lens movingapparatus shown in FIG. 1, from which a cover member is removed;

FIG. 3 is an exploded perspective view of a bobbin, a first coil, afirst magnet, a second magnet, a first position sensor, and a sensorboard, which are illustrated in FIG. 1;

FIG. 4 is a plan view illustrating the bobbin and the second magnet,which are illustrated in FIG. 3;

FIG. 5a is an exploded perspective view illustrating the sensor boardand the first position sensor, which are illustrated in FIG. 3;

FIG. 5b is a rear perspective view illustrating an embodiment of thesensor board illustrated in FIG. 3;

FIG. 6 is a top perspective view of the housing illustrated in FIG. 1;

FIG. 7 is a bottom exploded perspective view of the housing, the firstmagnet, and the second magnet, which are illustrated in FIG. 1;

FIG. 8 is a sectional view taken along line I-I′ in FIG. 2;

FIG. 9 is a plan perspective view illustrating the coupled state of thebobbin, the housing, the upper elastic member, the first positionsensor, the sensor board, and the plurality of support members, whichare illustrated in FIG. 1;

FIG. 10 is a bottom perspective view illustrating the coupled state ofthe bobbin, the housing, the lower elastic member, and the plurality ofsupport members, which are illustrated in FIG. 1;

FIG. 11 is an assembled perspective view illustrating the upper elasticmember, the lower elastic member, the first position sensor, the sensorboard, the base, the support members, and the circuit board, which areillustrated in FIG. 1;

FIG. 12 is an exploded perspective view illustrating the base, thesecond coil and the circuit board illustrated in FIG. 1;

FIGS. 13a to 13e illustrate embodiments of a first of third coil;

FIG. 14 illustrates the relative positional relationships among a firstmagnet, a second coil, a first of third coil and a first OIS positionsensor, which are aligned with one another;

FIG. 15 illustrates one example of the direction of a magnetic field ofthe first magnet, the second coil and the first of third coil, which arealigned with one another;

FIG. 16 illustrates another example of the direction of a magnetic fieldof the first magnet, the second coil and the first of third coil, whichare aligned with one another;

FIGS. 17a and 17b illustrate schematic views showing an outputexperiment of the OIS position sensor depending on a shape anddisposition of the first of third coil;

FIG. 17c illustrates a simulation experiment result obtained by theexperiment of FIGS. 17a and 17 b;

FIG. 18 is a perspective view of a lens moving apparatus according toanother embodiment;

FIG. 19 is an exploded perspective view of the lens moving apparatusshown in FIG. 18;

FIG. 20 is a cross-sectional view showing part of the lens movingapparatus shown in FIG. 19;

FIG. 21 is a cross-sectional view of the lens moving apparatus shown inFIG. 18;

FIG. 22 is a perspective view showing part of the lens moving apparatusshown in FIG. 20;

FIG. 23 is a perspective view showing part of a lens moving apparatusaccording to a further embodiment;

FIG. 24 is an exploded perspective view of a camera module according toan embodiment;

FIG. 25 is a perspective view illustrating a portable terminal accordingto an embodiment; and

FIG. 26 is a view illustrating the configuration of the portableterminal illustrated in FIG. 25.

BEST MODE

Hereinafter, embodiments will be clearly elucidated via descriptionthereof with reference to the accompanying drawings. In the followingdescription of the embodiments, it will be understood that, when anelement such as a layer (film), region, pattern, or structure isreferred to as being “on” or “under” another element, it can be“directly” on or under the other element, or can be “indirectly” formedsuch that an intervening element may also be present. In addition, itwill also be understood that the meaning of “on” and “under” aredetermined on the basis of the drawings. The same reference numbers willbe used throughout the drawings to refer to the same or like parts.

Hereinafter, a lens moving apparatus according to an embodiment will bedescribed with reference to the accompanying drawings. For theconvenience of description, although the lens moving apparatus isdescribed using a rectangular coordinate system (x, y, z), the lensmoving apparatus may be described using some other coordinate systems,and the embodiment is not limited thereto. In the respective drawings,the X-axis and the Y-axis mean directions perpendicular to anoptical-axis, i.e. the Z-axis, and the optical-axis (Z-axis) directionmay be referred to as a “first direction”, the X-axis direction may bereferred to as a “second direction”, and the Y-axis direction may bereferred to as a “third direction”.

A “handshake correction device”, which is applied to a subminiaturecamera module of a mobile device such as, for example, a smart phone ora tablet PC, may be a device that is configured to move a lens movingapparatus in a direction perpendicular to the optical-axis or to tiltthe lens moving apparatus so as to counteract vibration or motion causedby shaking of the user's hand when capturing a still image.

In addition, an “auto-focusing device” is a device that automaticallyfocuses an image of a subject on an image sensor by moving a lens movingapparatus in the optical-axis direction depending on the distance to thesubject. The handshake correction device and the auto-focusing devicemay be configured in various ways, and the lens moving apparatusaccording to the embodiment may move an optical module, which isconstituted of at least one lens, in the first direction, or relative toa plane defined by the second and third directions, which areperpendicular to the first direction, thereby performing handshakecorrection motion and/or auto-focusing.

FIG. 1 is a schematic perspective view illustrating the lens movingapparatus 100 according to an embodiment, and FIG. is an explodedperspective view of the lens moving apparatus 100 illustrated in FIG. 1.

Referring to FIGS. 1 and 2, the lens moving apparatus 100 may include acover member 300, an upper elastic member 150, a sensor board 180, afirst position sensor 170, a first coil 120, a bobbin 110, a housing140, a first magnet 130, a lower elastic member 160, a plurality ofsupport members 220, a circuit board 250, a third coil 260 and a base210.

The lens moving apparatus 100 according to the embodiment may furtherinclude a second magnet 190, which serves as a sensing magnet for thefirst position sensor 170.

The lens moving apparatus 100 according to the embodiment may furtherinclude a second coil 230, which interacts with the first magnet 130 forhandshake correction.

The lens moving apparatus 100 according to the embodiment may furtherinclude a second position sensor 240 for detecting the intensity of amagnetic field of the first magnet 130 for handshake correction.

First, the cover member 300 will be described.

The cover member 300 defines an accommodation space along with the base210, such that the upper elastic member 150, the bobbin 110, the firstcoil 120, the housing 140, the second magnet 190, the first magnet 130,the lower elastic member 160, the support members 220, the second coil230, and the circuit board 250 are accommodated in the accommodationspace.

The cover member 300 may take the form of a box that has an open bottomand includes an upper end portion and sidewalls. The bottom of the covermember 300 may be coupled to the top of the base 210. The upper endportion of the cover member 300 may have a polygonal shape, such as, forexample, a square or octagonal shape.

The cover member 300 may have a bore formed in the upper end portionthereof in order to expose a lens (not shown), coupled to the bobbin110, to outside light. In addition, the bore of the cover member 300 maybe provided with a window formed of a light-transmitting material, inorder to prevent impurities, such as, for example, dust or moisture,from entering a camera module.

Although the material of the cover member 300 may be a non-magneticmaterial such as, for example, SUS in order to prevent the cover member300 from being attracted by the first magnet 130, the cover member 300may be formed of a magnetic material, and may function as a yoke.

FIG. 3 is an assembled perspective view illustrating the lens movingapparatus 100 after removal of the cover member 300 of FIG. 1, and FIG.4 is an exploded perspective view of the bobbin 110, the first coil 120,the second magnet 190, the first magnets 130-1 to 130-4, the firstposition sensor 170, and the sensor board 180 illustrated in FIG. 1.

Next, the bobbin 110 will be described.

Referring to FIGS. 3 and 4, the bobbin 110 is placed inside the housing140, and is movable in the direction of the optical-axis or in the firstdirection, for example, in the Z-axis direction, via electromagneticinteraction between the first coil 120 and the first magnet 130.

The bobbin 110 may be provided with a lens mounted thereon, or mayinclude a lens barrel (not shown) in which at least one lens isinstalled. The lens barrel may be coupled inside the bobbin 110 invarious manners.

The bobbin 110 may be configured to have a bore for mounting the lens orthe lens barrel. The bore may have a circular, elliptical, or polygonalshape, without being limited thereto.

The bobbin 110 may include a first protrusion 111 and a secondprotrusion 112.

The first protrusion 111 of the bobbin 110 may include a guide portion111 a and a first stopper 111 b.

The guide portion 111 a of the bobbin 110 may serve to guide theposition at which the upper elastic member 150 is installed. Forexample, as exemplarily illustrated in FIG. 3, the guide portion 111 aof the bobbin 110 may define the path along which a first frameconnector 153 of the upper elastic member 150 extends.

For example, a plurality of guide portions 111 a may protrude in thesecond and third directions, which are perpendicular to the firstdirection. In addition, the guide portions 111 a may be arranged in apattern symmetric with respect to the center of the plane defined by thex-axis and the y-axis, as illustrated in the drawings, or may bearranged in a pattern asymmetric with respect to the center withoutinterference with other components, unlike the embodiment illustrated inthe drawings.

The second protrusion 112 of the bobbin 110 may be formed so as toprotrude in the second and third directions, which are perpendicular tothe first direction. In addition, the second protrusion 112 of thebobbin 110 may have an upper surface 112 a having a shape on which thefirst inner frame 151 is mounted.

The first stopper 111 b of the first protrusion 111 of the bobbin 110and the second protrusion 112 of the bobbin 110 may serve to prevent thebottom surface of the body of the bobbin 110 from directly collidingwith the base 210 and the upper surface of the circuit board 250 even ifthe bobbin 110 moves beyond a prescribed range due to, for example,external shocks, when being moved in the first direction parallel to theoptical-axis and a direction parallel to the first direction forauto-focusing.

The bobbin 110 may have a support groove 114, which is depressed fromthe upper surface of the bobbin 110 and disposed between the innercircumferential surface 110 a and the outer circumferential surface ofthe bobbin 110 so as to allow the sensor board 180 to be inserted intothe bobbin 110 in the first direction (in the Z-axis direction).

For example, the support groove 114 in the bobbin 110 may be providedbetween the inner circumferential surface 110 a and the outercircumferential surface 110 b of the bobbin 110 so as to enable theinsertion of the sensor board 180 in the first direction (in the Z-axisdirection). For example, the support groove 114 of the bobbin 110 may beprovided between the inner circumferential surface 110 a and the firstand second protrusions 111 and 112.

The bobbin 110 may have a receiving recess 116, in which the firstposition sensor 170, which is disposed, coupled, or mounted on thesensor board 180, is received or disposed.

For example, the receiving recess 116 of the bobbin 110 may be providedin the space between the first and second protrusions 111 and 112 of thebobbin 110, so as to allow the first position sensor 170, mounted on thesensor board 180, to be inserted in the first direction. The receivingrecess 116 of the bobbin 110 may be depressed from the outercircumferential surface of the bobbin 110, and may be connected oradjacent to the support groove 114.

The bobbin 110 may have a support protrusion 117 (see FIG. 8) formed onthe lower surface thereof so as to be coupled and fixed to the lowerelastic member 160.

When the state in which the lower surface of the first protrusion 111and the lower surface of the second protrusion 112 of the bobbin 110 arein contact with the bottom surface 146 a of a first mounting groove 146of the housing 140 is set to be an initial position, the auto-focusingfunction may be controlled as in unidirectional control in an existingvoice coil motor (VCM). Specifically, the bobbin 100 may be raised whencurrent is supplied to the first coil 120, and may be lowered when thesupply of current to the first coil 120 is cut off, thereby performingthe auto-focusing function.

However, when the position at which the lower surface of the firstprotrusion 111 and the lower surface of the second protrusion 112 of thebobbin 110 are spaced apart from the bottom surface 146 a of the firstseating groove 146 by a predetermined distance is set to be the initialposition of the bobbin 110, the auto-focusing function may be controlleddepending on the direction of current, as in bidirectional control in anexisting voice coil motor. Specifically, the auto-focusing function mayalso be fulfilled by moving the bobbin 110 in an upward or downwarddirection parallel to the optical-axis. For example, the bobbin 110 maybe moved upwards when forward drive current is applied to the first coil120, and may be moved downwards when reverse drive current is applied tothe first coil 120.

Next, the first coil 120 will be described.

The first coil 120 is disposed on the outer circumferential surface 110b (see FIG. 3) of the bobbin 110. The first coil 120 may be located soas not to overlap the first position sensor 170 in the second or thirddirection.

In order to ensure that the first coil 130 and the first position sensor170 do not interfere or overlap each other in the second or thirddirection, the first coil 120 and the first position sensor 170 may belocated on the outer circumferential surface 110 b of the bobbin 110 soas to be spaced apart from each other. For example, the first coil 120may be located on the lower side or the lower portion of the outercircumferential surface 110 a of the bobbin 110, and the first positionsensor 170 may be located on the upper side of the first coil 120.

The first coil 120, as exemplarily illustrated in FIG. 3, may bedisposed on the outer circumferential surface 110 a of the bobbin 110 soas to be wound in the clockwise or counterclockwise direction about theoptical-axis OA.

The first coil 120 may be fitted, disposed, wound or secured in a groove118 (see FIG. 8) formed in the outer circumferential surface 110 b ofthe bobbin 110.

In FIG. 3, although the first coil 120 may be situated directly on theouter circumferential surface 110 b of the bobbin 110, the disclosure isnot limited thereto. In another example, the first coil 120 may bedisposed on the outer circumferential surface 110 b of the bobbin 110via a coil ring. In this case, the coil ring may be coupled to thebobbin 110 in the same manner as the manner in which the sensor board180 is fitted into the support groove 114 in the bobbin 110.

As illustrated in FIG. 1, the first coil 120 may be configured to havean octagonal shape. The reason for this is because the shape of thefirst coil 120 is configured to correspond to the shape of the outercircumferential surface of the bobbin 110, which is octagonal, asillustrated in FIG. 5A.

At least four sides of the first coil 120 may be configured to have alinear shape, and the corner portions between the four sides may also beconfigured to have a linear shape. However, they may also be configuredto have a round shape.

The first coil 120 may produce electromagnetic force via electromagneticinteraction between the first coil 120 and the magnet 130 when a drivesignal, for example, drive current is supplied thereto, thereby movingthe bobbin 110 in the first direction using the electromagnetic force.

The first coil 120 may be configured to correspond to the first magnet130. When the first magnet 130 is constituted by a single body such thatthe surface of the first magnet 130 that faces the first coil 120 hasthe same polarity, the surface of the first coil 120 that faces thefirst magnet 130 may also be configured to have the same polarity.

If the first magnet 130 is divided into two or four segments by a plane,which is perpendicular to the optical-axis, such that the surface of themagnet 130 that faces the first coil 120 is correspondingly sectionedinto two or more surfaces, the first coil 120 may also be divided into anumber of coil segments that corresponds to the number of first magnetsegments.

Next, the first position sensor 170 and the sensor board 180 will bedescribed.

The first position sensor 170 may be disposed, coupled, or mounted onthe bobbin 110 so as to move along with the bobbin 110.

The first position sensor 170 may move along with the bobbin 110 whenthe bobbin 110 moves in the optical-axis direction OA.

The first position sensor 170 may detect the intensity of the magneticfield of the second magnet 190 depending on the movement of the bobbin110, and may form an output signal based on the result of the detection.The displacement of the bobbin 110 may be adjusted in the optical-axisdirection OA depending on the output signal of the first position sensor170.

For example, the first position sensor 170 may detect the sum of theintensity of the magnetic field of the second magnet 190 and theintensity of the magnetic field of the first magnet 130 depending on themovement of the bobbin 110, and may form an output signal based on theresult of the detection.

The first position sensor 170 may be conductively connected to thesensor board 180. The first position sensor 170 may take the form of adriver that includes a Hall sensor, or may take the form of a positiondetection sensor alone such as, for example, a Hall sensor.

The first position sensor 170 may be disposed, coupled, or mounted onthe bobbin 110 in various forms, and may receive current in various waysdepending on the manner in which the first position sensor 170 isdisposed, coupled, or mounted.

The first position sensor 170 may be disposed, coupled, or mounted onthe outer circumferential surface 110 b of the bobbin 110.

For example, the first position sensor 170 may be disposed, coupled, ormounted on the sensor board 180, and the sensor board 180 may bedisposed or coupled to the outer circumference surface 110 b of thebobbin 110. In other words, the first position sensor 170 may beindirectly disposed, coupled or mounted on the bobbin 110 via the sensorboard 180.

The first position sensor 170 may be conductively connected to at leastone of the upper elastic member 150 and the lower elastic member 160,which will be described later. For example, the first position sensor170 may be conductively connected to the upper elastic member 150.

FIG. 4 is a plan view illustrating the bobbin 110 and the first magnet130 (130-1, 130-2, 130-3 and 130-4), which are illustrated in FIG. 3.FIG. 5a is an exploded perspective view illustrating the sensor board180 and the first position sensor 170, which are illustrated in FIG. 3.FIG. 5b is a rear perspective view illustrating the sensor board 180according to an embodiment, which is illustrated in FIG. 3.

Referring to FIGS. 3 to 5 c, the sensor board 180 may be mounted on thebobbin 110, and may move along with the bobbin 110 in the optical-axisdirection OA.

For example, the sensor board 180 may be coupled to the bobbin 110 bybeing fitted or disposed in the support groove 114 in the bobbin 110. Itis sufficient for the sensor board 180 to be mounted on the bobbin 110.Although FIG. 5a illustrates a sensor board 180 having an open ringshape, the disclosure is not limited thereto.

The first position sensor 170 may be attached to and supported by thefront surface of the sensor board 180 using an adhesive member such as,for example, epoxy or a piece of double-sided tape.

The outer circumferential surface 110 b of the bobbin 110 may includefirst side surfaces S1 and second side surfaces S2. The first sidesurfaces S1 correspond to first side portions 141 of the housing 140 onwhich the first magnet 130 is disposed. The second side surfaces S2 arelocated between the first side surfaces S1 so as to connect the firstside surfaces S1 to one another.

The first position sensor 170 may be disposed on any one of the firstside surfaces S1 of the bobbin 110. For example, the recess 116 in thebobbin 110 may be provided in either one of the first side surfaces S1of the bobbin 110, and the first position sensor 170 may be located inthe recess 116 in the bobbin 110.

The first position sensor 170 may be disposed, coupled, or mounted to anupper portion, a middle portion, or a lower portion of the outercircumferential surface of the sensor board 180 in various forms.

For example, the first position sensor 170 may be disposed on any one ofthe upper portion, the middle portion and the lower portion of the outercircumferential surface of the sensor board 180 so as to be disposed ordirected in the first direction in the space between the first andsecond magnets 190 and 130 at the initial position of the bobbin 110.The first position sensor 170 may receive a drive signal, for example,drive current, from outside through a circuit of the sensor board 180.

For example, the first position sensor 170 may be disposed, coupled ormounted on the upper portion of the outer circumferential surface of thesensor board 180 so as to be positioned or arranged in the space betweenthe first and second magnets 190 and 130 in the first direction at theinitial position of the bobbin 110. The first position sensor 170 may bedisposed on the upper portion of the outer circumferential surface ofthe sensor board 180 so as to be positioned as far from the first coil120 as possible such that the first position sensor 170 is notinfluenced by the magnetic field generated by the first coil 120,thereby preventing malfunctions or errors of the first position sensor170.

For example, the sensor board 180 may have a mounting recess 183 formedin the upper portion of the outer circumferential surface thereof, andthe first position sensor 170 may be disposed, coupled or mounted in themounting recess 183 in the sensor board 180.

In order to allow more efficient injection of epoxy or the like forassembly of the first position sensor 170, at least one surface of themounting recess 183 of the sensor board 180 may be provided with aninclined surface (not shown). Although additional epoxy or the like maynot be injected into the mounting recess 183 in the sensor board 180, itmay be possible to increase the force with which the first positionsensor 170 is disposed, coupled or mounted by injecting epoxy or thelike into the mounting recess 183.

The sensor board 180 may include a body 182, elastic member contactportions 184-1 to 184-4, and a circuit pattern L1-L4.

When the support groove 114 in the bobbin 110 has the same shape as thatof the outer circumferential surface of the bobbin 1100, the body 182 ofthe sensor board 180, which is fitted into the support groove 114 in thebobbin 110, may have a shape that is capable of being fitted into thegroove 114 and being secured therein.

Although the support groove 114 in the bobbin 110 and the body 182 ofthe sensor board 180 may have a circular flat ring or strip shape whenviewed in a plan view, as illustrated in FIGS. 3 to 5 c, the disclosureis not limited thereto. In another embodiment, the support groove 114 inthe bobbin 110 and the body 182 of the sensor board 180 may have apolygonal shape when viewed in a plan view.

The body 182 of the sensor board 180 may include a first segment 182 a,on which the first position sensor 170 is disposed, coupled, or mounted,and a second segment 182 b, which extends from the first segment 182 aand which is fitted into the support groove 114 in the bobbin 110.

Although the sensor board 180 may have an opening 181 in the portionthereof that faces the first segment 182 a so as to be easily fittedinto the support groove 114 in the bobbin 110, the disclosure is notlimited to any specific structure of the sensor board 180.

The elastic member contact portions 184-1 to 184-4 of the sensor board180 may protrude from the body 182 of the sensor board 180, for example,in the first direction, i.e., the optical-axis direction or a directionparallel to the first direction such that the contact portions can comeinto contact with the first inner frame 151.

The elastic member contact portions 184-1 to 184-4 of the sensor board180 may be connected or coupled to the first inner frame 151 of theupper elastic member 150.

The circuit pattern L1-L4 of the sensor board 180 may be formed on thebody 182 of the sensor board 180 so as to conductively connect the firstposition sensor 170 and the elastic member contact portions 184-1 to184-4 to each other.

The first position sensor 170 may be embodied as a Hall sensor, forexample, but may be embodied as any sensor as long as it is able todetect the intensity of a magnetic field. If the first position sensor170 is embodied as a Hall sensor, the Hall sensor may include aplurality of pins.

For example, the plurality of pins may include input pins P11 and P12and output pins P21 and P22. Signals output through the output pins P21and P22 may be a current type or a voltage type.

The input pins P11 and P12 and the output pins P21 and P22 of the firstposition sensor 170 may be conductively connected to the respectiveelastic member contact portions 184-1 to 184-4 via the circuit patternL1 to L4.

In an embodiment, the first to fourth lines L1 to L4 may be formed so asto be visible to the naked eye. In another embodiment, the first tofourth lines L1 to L4 may be formed in the body 182 of the sensor board180 so as not to be visible to the naked eye.

Next, the housing 140 will be described.

The housing 140 may support the first magnet 130 for driving, and mayaccommodate the bobbin 110 therein such that the bobbin 110 is allowedto move in the optical-axis direction OA.

The housing 140 may support or accommodate the second magnet 190 fordetection.

The housing 140 may generally have a hollow column shape. For example,the housing 140 may have a polygonal (e.g., a square or octagonal) orcircular bore 201.

FIG. 6 is a perspective view of the housing 140 and the second magnet190 illustrated in FIG. 1. FIG. 7 is an exploded perspective view of thehousing 140 and the first magnet 130, which are illustrated in FIG. 1.FIG. 8 is a sectional view taken along line I-I′ in FIG. 3. FIG. 9 is aperspective view of the coupled state of the bobbin 110, the housing140, the upper elastic member 150, the first position sensor 170, thesensor board 180, and the support members 220, which are illustrated inFIG. 2. FIG. 10 is a perspective view of the coupled state of the bobbin110, the housing 140, the lower elastic member 160, and the supportmembers 220, which are illustrated in FIG. 2.

The housing 140 may have the first seating groove 146 formed at aposition thereof corresponding to the first protrusion 111 and thesecond protrusion 112 of the bobbin 110.

The housing 140 may include a third protrusion 148, which corresponds tothe space defined between the first protrusion 111 and the secondprotrusion 112, and which has a first width W1.

The third protrusion 148 of the housing 140, which is opposite thebobbin 110, may have a surface having the same shape as the side portionof the bobbin 110. Here, there may be a predetermined difference betweenthe first width W1 between the first and second protrusions 111 and 112of the bobbin 110, which is illustrated in FIG. 3, and the second widthW2 of the third protrusion 148 of the housing 140, which is illustratedin FIG. 6. Consequently, it is possible to restrict the rotation of thethird protrusion 148 between the first protrusion 111 and the secondprotrusion 112 of the bobbin 110. As a result, it is possible for thethird protrusion 148 of the housing 140 to prevent the bobbin 110 frombeing rotated even if the bobbin 110 receives force in the direction inwhich the bobbin 110 is rotated about the optical-axis OA, rather thanbeing rotated in the optical-axis direction OA.

For example, the upper edge of the outer periphery of the housing 140may have a square plan shape, whereas the lower edge of the innerperiphery may have an octagonal plan shape, as exemplarily illustratedin FIGS. 6 and 7.

The housing 140 may include a plurality of side portions.

For example, the housing 140 may include four first side portions 141and four second side portions 142, and the width of each of the firstside portions 141 may be greater than the width of each of the secondside portions 142. For example, the four first side portions 141 may bereferred to as first to fourth sides, and the four second side portions142 may be referred to as first to fourth corner portions.

The first side portions 141 of the housing 140 may correspond to theportions on which the first magnet 130 is mounted. Each of the secondside portions 142 of the housing 140 may be disposed between the twoadjacent first side portions 141, and may correspond to portions onwhich the support members 220 are disposed. Each of the first sideportions 141 of the housing 140 may connect the two adjacent second sideportions 142 of the housing 140 to each other.

Each of the first side portions of the housing 140 may have a surfacearea that is equal to or larger than the surface area of the firstmagnet 130, which corresponds to the first side portion 141.

The housing 140 may have a first magnet seat 141 a for accommodating thefirst magnets 130-1 to 130-4 and second magnet seats 141 b foraccommodating the second magnet 190.

For example, the first magnet seat 141 a of the housing 140 may beprovided in the lower ends of the inner portions of the first sideportions 141, and the second magnet seats 141 b may be provided in theupper end of the outer portion of either one of the first side portions141.

The second magnet seat 141 b may be positioned above the first magnetseats 141 a, and may be spaced apart from the first magnet seats 141 a.

The second magnet 190 may be fitted in, disposed in or secured to thesecond magnet seat 141 b, and each of the first magnets 130-1 to 130-4may be disposed or fixed to the first magnet seat 141 a, which isprovided on a corresponding one of the first side portions 141 of thehousing 140.

The first magnet seat 141 a of the housing 140 may be configured to havethe form of a recess having a size corresponding to the size of thefirst magnet 130, and may be configured to face at least three of thesurfaces of the first magnet 130, that is, two lateral side surface andthe upper surface of the first magnet 130.

An opening may be formed in the bottom surface of the first magnet seat141 a of the housing 140, that is, the surface that is opposite thesecond coil 230, which will be described later, and the bottom surfaceof the first magnet 130 seated on the first magnet seat 141 a maydirectly face the second coil 230.

The first and second magnets 130 and 190 may be secured to the first andsecond magnet seats 141 a and 141 b of the housing 140 using anadhesive, without being limited thereto, and an adhesive member such asa piece of double-sided tape may be used.

Alternatively, the first and second magnet seats 141 a and 141 b of thehousing 140 may be configured as mounting holes, which allow the firstand second magnets 130 and 190 to be partially fitted thereinto or to bepartially exposed therefrom, rather than being configured as the recessillustrated in FIGS. 6 and 7.

For example, the second magnet 190 may be positioned above one (forexample, 130-1) of the first magnets 130-1, 130-2, 130-3 and 130-4. Thesecond magnet 190 may be disposed so as to be spaced apart from thefirst magnet (for example, 130-1). A portion of the housing 140 may bedisposed between the second magnet 190 and the first magnet (forexample, 130-1).

The first side portion 141 of the housing 140 may be oriented parallelto the side surface of the cover member 300. In addition, the first sideportion 141 of the housing 140 may be larger than the second sideportion 142. The second side portion 142 of the housing 140 may beprovided with paths through which the support members 220 extend. Firstthrough-holes 147 may be formed in the upper portion of the second sideportion 142 of the housing 140. The support members 220 may be connectedto the upper elastic member 150 through the first through holes 147.

In addition, in order to prevent the housing 140 from directly collidingwith the inner side surface of the cover member 300 illustrated in FIG.1, the housing 140 may be provided at the upper end thereof, forexample, on the upper surface of the second side portion 142, with asecond stopper 144.

The housing 140 may include at least one first upper support protrusion143 formed on the upper surface thereof for coupling to the upperelastic member 150.

For example, the first upper support protrusion 143 of the housing 140may be formed on the upper surface of the housing 140 corresponding tothe second side portion 142 of the housing 140, without being limitedthereto. In another embodiment, the first upper support protrusion 143may be formed on the upper surface of the housing 140 that correspondsto the first side portion 141.

The first upper support protrusion 143 of the housing 140 may have asemispherical shape, as illustrated in the drawings, or may have acylindrical shape or a square column shape, without being limitedthereto.

The housing 140 may have a lower support protrusion 145 formed on thelower surface thereof for coupling and fixing to the lower elasticmember 160.

In order to define paths for the passage of the support members 220 andto ensure the space to be filled with gel-type silicone, which serves asa damper, the housing 140 may have a first recess 142 a formed in thesecond side portion 142. In other words, the first recess 142 a of thehousing 140 may be filled with damping silicone.

The housing 140 may have a plurality of third stoppers 149 protrudingfrom the side portions 141 thereof. The third stoppers 149 serve toprevent the housing 140 from colliding with the cover member 300 whenthe housing 140 moves in the second and third directions.

In order to prevent the bottom surface of the housing 140 from collidingwith the base 210 and/or the circuit board 250, which will be describedbelow, the housing 140 may further have a fourth stopper (not shown)protruding from the bottom surface thereof. Through this configuration,the housing 140 may be spaced apart from the base 210, which is disposedthereunder, and may be spaced apart from the cover member 300, which isdisposed thereabove, with result that the housing 140 may be maintainedat a predetermined position in the optical-axis direction withoutinterference therebetween. In this way, the housing 140 may perform ashifting action in the second and third direction, that is, theanteroposterior direction and the lateral direction, on a planeperpendicular to the optical-axis.

The housing 140 is not limited to that illustrated in FIGS. 6 and 7. Inanother embodiment, the description regarding the housing 1310illustrated in FIGS. 19 to 23 may be applied. The cover member 300illustrated in FIG. 1 may include a round portion configured to connectthe top plate to the side plate and to connect the side plates to eachother, which is illustrated in FIG. 18. The description regarding thetop plate 1101, the side plates 1102 and the round portion 1103 of thecover member 1100 illustrated in FIG. 18 may be applied to the topplate, the side plates and the round portion of the cover member 300,which are illustrated in FIG. 1.

For example, a housing according to another embodiment may include aprotrusion 1330, an upper stopper 1340 and a support member recess 1350.

The housing according to the embodiment may include the protrusion 1330extending upwards from the upper surface thereof and positioned outsidethe upper elastic member 150.

The protrusion 1330 of the housing according to the embodiment may bepositioned at at least one of the first to fourth corner portions of thehousing. For example, the protrusion 1330 of the housing may include thefirst to fourth protrusions illustrated in FIG. 20. The first imaginaryline, which connects the center of the first protrusion 1331 with thecenter of the third protrusion 1333, may be orthogonal to the secondimaginary line, which connects the center of the second protrusion 1332with the center of the fourth protrusion 1334, at the center of thehousing 1310.

The protrusion of the housing according to the embodiment may overlapthe upper elastic member 150 in a direction perpendicular to theoptical-axis. By virtue of this configuration, the protrusion 1330 ofthe housing according to the embodiment is able to prevent the upperelastic member 150 from being exposed to the outside in the diagonaldirection.

The protrusion 1330 of the housing according to the embodiment may bepositioned outside of the upper stopper 1340. The upper end of theprotrusion 1330 of the housing according to the embodiment may bepositioned so as to be lower than the upper end of the upper stopper1340 but higher than the upper elastic member 150. The protrusion 1330of the housing according to the embodiment may overlap the round portionof the cover member 300 in the optical-axis direction.

For example, the protrusion 1330 of the housing according to theembodiment may overlap the round portion of the cover member 300 in thevertical direction or in a direction parallel to the optical-axis.

The upper stopper 1340 of the housing according to the embodiment mayoverlap the top plate of the cover member 300 in a direction parallel tothe optical-axis. For example, the upper stopper 1340 of the housingaccording to the embodiment may not overlap the round portion of thecover member 300 in a direction parallel to the optical-axis. By virtueof this configuration, the upper stopper 1340, rather than theprotrusion 1330, may come into contact with the inner surface of the topplate of the cover member 300 when the housing according to theembodiment moves fully upward.

The protrusion 1330 of the housing according to the embodiment may beconfigured such that the upper elastic member 150 and the solderinginitiation portion of the support member 220 are shielded when the lensmoving apparatus is viewed in a diagonal direction (at an angle of 45degrees with respect to the side surface).

The top end of the upper stopper 1340 of the housing according to theembodiment may define the top end of the housing. By virtue of thisconfiguration, when the housing is moved upward due to application ofexternal force, the upper stopper 1340 comes into contact with the covermember 300, thereby limiting movement of the housing. In a modification,the protrusion 1330 of the housing according to the embodiment may beintegrally formed with the upper stopper 1340. In other words, the upperstopper 1340 may be omitted. In this case, the upper end of theprotrusion 1330 of the housing according to the embodiment may serve asthe top end of the housing.

The housing according to the embodiment may include the upper stopper1340, which extends upwards from the upper surface thereof and ispositioned inside the protrusion 1330. In other words, the protrusion ofthe housing according to the embodiment may be positioned outside of theupper stopper.

The upper stopper 1340 of the housing according to the embodiment mayoverlap the cover member 300 in the optical-axis direction. By virtue ofthis configuration, when the housing moves upwards, the upper stopper1340 comes into contact with the cover member 300, thereby limiting themovement of the housing.

The housing according to the embodiment may include the support memberrecess 1350, which accommodates the support member 220 and is positionedinside the protrusion 1330. The support member recess 1350 of thehousing according to the embodiment may be formed by depressing aportion of the side surface of the housing 1310 inwards.

The size of the support member recess 1350 in the housing according tothe embodiment may be smaller at the portion thereof at which a steppedportion 1360 is formed than at the upper end of the support memberrecess 1350. The size of the support member recess 1350 in the housingaccording to the embodiment in the horizontal direction may be reducedsomewhat due to the stepped portion 1360. By virtue of thisconfiguration, it is possible to prevent a first damper introduced intothe support member recess 1350 of the housing according to theembodiment from flowing downwards.

Next, the first magnet 130 and the second magnet 190 will be described.

The first magnet 130 may be disposed on the first magnet seat 141 a ofthe housing 140 so as to overlap the first coil 120 in the directionperpendicular to the optical-axis OA.

In another embodiment, both the first and second magnets 130 and 190 maybe disposed outside or inside the first side portion 141 of the housing140, or may be disposed inside or outside the second side portion 142 ofthe housing 140.

In a further embodiment, the second magnet 190 may be disposed in theinner portion of the first side portion 141 of the housing 140, and thefirst magnet 130 may be disposed in the outer portion of the first sideportion 141 of the housing 140.

In yet a further embodiment, the first magnet 130 may be disposed in theinner portion or the outer portion of the first side portion 141 of thehousing 140, and the second magnet 190 may be disposed on the secondside portion 142.

The first magnet 130 may have a form that corresponds to the first sideportion 141 of the housing 140, that is, the form of an approximatelyrectangular parallelepiped. The surface of the first magnet 130 thatfaces the first coil 120 may have a radius of curvature that correspondsto that of the first coil 120.

The first magnet 130 may be configured as a single body, and may beoriented such that the surface thereof facing the first coil 120 is theS-pole 132 and the opposite surface is the N-pole 134, without beinglimited thereto, and the opposite configuration is also possible.

At least two first magnets 130 may be provided, and in the embodiment,four first magnets 130 may be installed. The first magnet 130 may havean approximately rectangular shape, or may have a triangular or diamondshape.

Although the surface of the first magnet 130 that faces the first coil120 may be planar, the disclosure is not limited thereto. Thecorresponding surface of the first coil 120 is curved, and the surfaceof the first magnet 130 that faces the first coil 120 may be curved soas to have the same radius of curvature as that of the surface of thefirst coil 120. By virtue of this configuration, it is possible to keepthe distance between the first magnet 130 and the first coil 120constant.

In an embodiment, four first side portions 141 of the housing 140 may beprovided with the first magnets 130-1, 130-2, 130-3 and 130-4,respectively, without being limited thereto. In some designs, only oneof the first magnet 130 and the first coil 120 may have a flat surface,and the other of the first magnet 130 and the first coil 120 may have acurved surface. Alternatively, both the first coil 120 and the firstmagnet 130, which face each other, may have curved surfaces. In thiscase, the surface of the first coil 120 may have the same radius ofcurvature as the surface of the first magnet 130.

When the first magnets 130 have a rectangular flat surface, a pair ofmagnets 130-1 and 130-3, among the plurality of first magnets 130-1 to130-4, may be arranged in the second direction so as to be parallel toeach other, and the other pair of magnets 130-2 and 130-4 may bearranged in the third direction so as to be parallel to each other. Byvirtue of this arrangement, it is possible to control the movement ofthe housing 140 for handshake correction, which will be described later.

In the embodiment illustrated in FIGS. 2 to 9, the first position sensor170 is disposed at the bobbin 110, and the second magnet 190 is disposedat the housing 140, without being limited thereto. In anotherembodiment, the first position sensor may be disposed at the first sideportion or the second side portion of the housing 140, and the secondmagnet may be disposed on the outer circumferential surface of thebobbin 110.

Next, the upper elastic member 150, the lower elastic member 160, andthe support members 220 will be described.

The upper elastic member 150 and the lower elastic member 160elastically support the bobbin 110. The support members 220 may supportthe housing 140 so as to be movable relative to the base 210 in thedirection perpendicular to the optical-axis, and may conductivelyconnect at least one of the upper and lower elastic members 150 and 160to the circuit board 250.

FIG. 11 is an assembled perspective view illustrating the upper elasticmember 150, the lower elastic member 160, the first position sensor 170,the sensor board 180, the base 210, the support members 220, and thecircuit board 250, which are illustrated in FIG. 1.

The upper elastic member 150 may include a plurality of upper elasticmembers 150 (150-1 to 150-4), which are conductively isolated and spacedapart from one another.

The elastic member contact portions 184-1 to 184-4 of the sensor board180 may be conductively connected to at least one of the upper elasticmember 150 and the lower elastic member 160.

Although FIG. 11 illustrates by way of example that the elastic membercontact portions 184-1 to 184-4 come into electrical contact with theupper elastic members 150-1 to 150-4, the disclosure is not limitedthereto. In another embodiment, the elastic member contact portions184-1 to 184-4 may come into electrical contact with the lower elasticmember 160, or may come into electrical contact with both the upperelastic member 150 and the lower elastic member 160.

Each of the respective elastic member contact portions 184-1 to 184-4,which are conductively connected to the first position sensor 170, maybe conductively connected to a corresponding one of the upper elasticmembers 150-1 to 150-4. Each of the upper elastic members 150-1 to 150-4may be conductively connected to a corresponding one of the plurality ofsupport members 220.

Each one 150 a of the first and third upper elastic members 150-1 and150-3 may include a first inner frame 151, a first of first outer frame152 a, and a first frame connector 153.

Each one 150 b of the second and fourth upper elastic members 150-2 and150-4 may include the first inner frame 151, a second of first outerframe 152 b, and the first frame connector 153.

The first inner frame 151 of the first to fourth upper elastic members150-1 to 150-4 may be coupled to a corresponding one of the bobbin 110and the elastic member contact portions 184-1 to 184-4.

As illustrated in FIG. 3, when the upper surface 112 a of the secondprotrusion 112 of the bobbin 110 is flat, the first inner frame 151 ofthe upper elastic member 150 may be placed on the upper surface 112 a ofthe second protrusion 112 of the bobbin 110, and may be secured theretousing an adhesive member.

The first of first outer frame 152 a and the second of first outer frame152 b may be coupled to the housing 140, and may be connected to thesupport members 220.

The first frame connector 153 may connect the first inner frame 151 tothe first of first outer frame 152 a, and may connect the first innerframe 151 to the second of first outer frame 152 b.

Although the first outer frame 152 b may be formed by bisecting thefirst of first outer frame 152 a, the disclosure is not limited thereto.In another embodiment, the first of first outer frame may be bisected soas to have the same shape as the second of first outer frame 152 b.

The first frame connector 153 may be bent at least one time so as toform a predetermined pattern. Upward and/or downward movement of thebobbin 110 in the optical-axis direction OA may be elastically supportedvia positional variation and fine deformation of the first frameconnector 153.

The first of first outer frame 152 a and the second of first outer frame152 b of the upper elastic member 150 illustrated in FIG. 11 may becoupled and secured to the housing 140 by means of the first uppersupport protrusion 143 of the housing 140. In the embodiment, each ofthe first of first outer frame 152 a and the second of first outer frame152 b may be formed with a second of second through-hole 157, which hasa shape and position corresponding to those of the first upper supportprotrusion 143. Here, the first upper support protrusion 143 and thesecond of second through-hole 157 may be fixed or coupled to each othervia thermal fusion, or using an adhesive such as, for example, epoxy.

By virtue of conductive connections between the elastic member contactportions 184-1 to 184-4 of the sensor board 180 and the first to fourthupper elastic members 150-1 to 150-4 via conductive adhesive members,such as solder, four pins P11 to P22 of the first position sensor 170may be conductively connected to the first to fourth upper elasticmembers.

The respective first to fourth upper elastic members 150-1 to 150-4 maybe connected or coupled to the circuit board 250 via the support members220.

For example, the first upper elastic members 150-1 may be conductivelyconnected to the circuit board 250 via at least one of the first offirst support member 220-1 a and the second of first support member220-1 b, and the second upper elastic members 150-2 may be conductivelyconnected to the circuit board 250 via the second support members 220-2.The third upper elastic members 150-3 may be conductively connected tothe circuit board 250 via at least one of the first of third supportmember 220-3 a and the second of third support member 220-3 b, and thefourth upper elastic members 150-4 may be conductively connected to thecircuit board 250 via the fourth support members 220-4.

The first position sensor 170 may receive a drive signal (for example,drive current) from the circuit board 250 through two of the first tofourth upper elastic members 150-1 to 150-4 and the support membersconnected to the upper elastic members (for example, 220). The firstposition sensor 170 may output an output signal (for example, detectionvoltage) thereof to the circuit board 250 through the remaining two ofthe first to fourth upper elastic members 150-1 to 150-4 and the supportmembers connected to the upper elastic members (for example, 220).

Meanwhile, the lower elastic member 160 may include first and secondlower elastic members 160-1 and 160-2, which are conductively isolatedand spaced apart from each other. The first coil 120 may be connected tothe plurality of support members 220 through the first and second lowerelastic members 160-1 and 160-2.

Each of the first and second lower elastic members 160-1 and 160-2 mayinclude at least one second inner frame 161-1 or 161-2, at least onesecond outer frame 162-1 or 162-2, and at least one second frameconnector 163-1 or 163-2.

The second inner frames 161-1 and 161-2 of the first and second lowerelastic members 160-1 and 160-2 may be coupled to the bobbin 110, andthe second outer frames 162-1 and 162-2 may be coupled to the housing140.

The first of second frame connector 163-1 may connect the second innerframe 161-1 and the second outer frame 162-1 to each other, the secondof second frame connector 163-2 may connect the two second outer frames161-1 and 162-2 to each other, and the third of second frame connector163-3 may connect the second inner frame 161-2 and the second outerframe 162-2 to each other.

The first lower elastic member 160-1 may further include a first coilframe 164-1 connected to the second inner frame, and the second lowerelastic member 160-2 may further include the second coil frame 164-2connected to the second inner frame.

Referring to FIG. 11, each of the first and second coil frames 164-1 and164-2 may be connected to a corresponding one of two ends of the firstcoil 120 via conductive connection members such as solder. The first andsecond lower elastic members 160-1 and 160-2 may receive drive signals(for example drive current) from the circuit board 250, and may transferthe drive signals to the first coil 120.

Each of the first and second lower elastic members 160-1 and 160-2 mayfurther include a fourth of second frame connector 163-4. The fourth ofsecond frame connector 163-4 may connect the coil frame 164 to thesecond inner frame 161-2.

At least one of the first of second to fourth of second frame connectors163-1 to 163-4 may be bent once or more so as to define a predeterminedpattern. In particular, by positional variation and fine deformation ofthe first of second and third of second frame connectors 163-1 and163-3, upward and/or downward movement of the bobbin 110 in the firstdirection, parallel to the optical-axis, may be elastically supported.

In an embodiment, each of the first and second lower elastic members160-1 and 160-2 may further include a bent portion 165 so as to beconnected to a corresponding one of the upper elastic members 150-1 to150-4, as illustrated in the drawings. The bent portion 165 may be bentat the second of second frame connector 163-2 toward the correspondingupper elastic member 150-5 or 150-6 in the first direction.

The upper elastic member 160 may further include fifth and sixth upperelastic members 150-5 and 150-6. The first to sixth upper elasticmembers 150-1 to 150-6 may be conductively isolated and spaced apartfrom one another.

Each of the fifth and sixth upper elastic members 150-5 and 150-6 mayinclude a first of second outer frame 155, coupled to the second sideportion of the housing 140, and a connecting frame 154 extending fromthe first of second outer frame 155.

The connecting frame 154 of the fifth upper elastic member 150-5 may beconnected to the bent portion 165 of the second lower elastic member160-2, and the connecting frame 154 of the sixth upper elastic member150-6 may be connected to the bent portion 165 of the first lowerelastic member 160-1.

Each of the outer frames 155 of the fifth and sixth upper elasticmembers 150-5 and 150-6 may be bent at the connecting frame 154 in thedirection perpendicular to the first direction, and may be coupled tothe housing 155. The outer frame 155 may be connected to the supportmember 220.

In other words, the fifth upper elastic member 150-5 may be connected tothe fifth support member 220-5, and the sixth upper elastic member 150-6may be connected to the sixth support member 220-6.

Here, the bent portion 165 of each of the first and second lower elasticmembers 160-1 and 160-2 may be integrally formed with the connectingframe 154 of a corresponding one of the fifth or sixth upper elasticmembers 150-5 and 150-6 and the outer frame 155. Each of the first andsecond lower elastic members 160-1 and 160-2 and the fifth and sixthupper elastic members 150-5 and 150-6 may include portions 165 and 154,which are bent in the first direction.

By virtue of the bent portion 165 of the connecting frame 154, the firstlower elastic member 160-1 may be conductively connected to the sixthupper elastic member 150-6, and the second lower elastic member 160-2may be conductively connected to the fifth upper elastic member 150-5.

Drive signals from the circuit board 250 may be provided to the firstcoil 120 via the first and second lower elastic members 160-1 and 160-2,the support members 220-5 and 220-6 and the fifth and sixth upperelastic members 150-5 and 150-6. Specifically, the first lower elasticmember 160-1 may be conductively connected to the circuit board 250 viathe sixth upper elastic member 150-6 and the sixth support member 220-6,and the second lower elastic member 160-2 may be conductively connectedto the circuit board 250 via the fifth upper elastic member 150-5 andthe fifth support member 220-5.

Although each of the upper and lower elastic members 150 and 160 of theembodiment is divided into two or more parts, in another embodiment, atleast one of the upper and lower elastic members 150 and 160 may not bedivided.

The second support protrusion 117 of the bobbin 110 may be coupled andsecured to the second inner frame 161-1 or 161-2 of the lower elasticmember 160. The second lower support protrusion 145 of the housing 140may be coupled and secured to the second outer frame 162-1 or 162-2 ofthe lower elastic member 160.

Each of the second inner frames 161-1 and 161-2 of the first and secondlower elastic members 160-1 and 160-2 may be provided with a thirdthrough hole 161 a, which is formed at a position corresponding to thefirst lower support protrusion 117 of the bobbin 110 so as to have ashape corresponding to the first lower support protrusion 117 of thebobbin 110. Here, the first lower support protrusion 117 of the bobbin110 and the third through hole 161 a may be secured to each other viathermal fusion, or using an adhesive member such as epoxy.

Each of the second outer frames 162-1 and 162-2 of the first and secondlower elastic members 160-1 and 160-2 may be provided with a fourththrough hole 162 a at a position corresponding to the second lowersupport protrusion 145 of the housing 140. Here, the second lowersupport protrusion 145 of the housing 140 and the fourth through hole162 a may be secured to each other via thermal fusion, or using anadhesive member such as epoxy.

Although each of the upper elastic member 150 and the lower elasticmember 160 may be constituted by a leaf spring, the disclosure is notrestricted as to the material used for the upper and lower elasticmembers 150 and 160.

The power or a drive signal may be supplied to the first position sensor170 via two upper elastic members, which are conductively isolated fromeach other, signals output from the first position sensor 170 may betransferred to the circuit board 250 via the other two upper elasticmembers, which are conductively isolated from each other, and power or adrive signal may be supplied to the first coil 120 via two lower elasticmembers 160-1 and 160-2, which are conductively isolated from eachother. However, the disclosure is not limited thereto.

In another embodiment, the role of the plurality of upper elasticmembers 150 and the role of the plurality of lower elastic members 160may be exchanged. In other words, power may be supplied to the firstcoil 120 via two upper elastic members, which are conductively isolatedfrom each other, power may be supplied to the first position sensor 170via two lower elastic members, which are conductively isolated from eachother, and signals output from the first position sensor 170 may betransferred to the circuit board 250 via the other two lower elasticmembers, which are conductively isolated from each other. Although thisarrangement is not illustrated in the drawings, it will be apparent fromthe drawings.

Next, the support members 220 will be described.

The plurality of support members 220-1 to 220-6 may be disposed atrespective second side portions 142 of the housing 140. For example,although two support members may be disposed at each of the four secondside portions 142, the disclosure is not limited thereto.

In another embodiment, only one support member may be disposed at eachof two side portions 142 among the four second side portions 142 of thehousing 140, and two support members may be disposed at each of theother two side portions 142.

In a further embodiment, the support members 220 may be disposed in theform of a leaf spring at the first side portions of the housing 140.

The support members 220 may be embodied as members for elastic support,for example leaf springs, coil springs, suspension wires or the like. Inanother embodiment, the support members 220 may be integrally formedwith the upper elastic member.

Next, the base 210, the circuit board 250, and the second coil 230 willbe described.

The base 210 may have a bore corresponding to the bore of the bobbin 110and/or the bore of the housing 140, and may have a shape thatcorresponds to that of the cover member 300, for example, a squareshape.

FIG. 12 is an exploded perspective view of the base 210, the second coil230, and the circuit board 250, which are illustrated in FIG. 1.

The base 210 may have a stepped portion 211, to which an adhesive may beapplied when the cover member 300 is secured to the base 210 using theadhesive. Here, the stepped portion 211 may guide the cover member 300coupled to the upper side thereof, and may be coupled to the end of thecover member 300 in a surface-contact manner.

The stepped portion 211 of the base 210 and the end of the cover member300 may be attached or secured to each other using an adhesive or thelike.

The base 210 may be provided with a support portion 255 having acorresponding size on the surface thereof facing the terminal 251 of thecircuit board 250. The support portion 255 of the base 210 may be formedon the outer side surface of the base 210, which does not have thestepped portion, and may support a terminal rib 253 of the circuit board250.

A second recess 212 may be formed in each corner of the base 210. Whenthe cover member 300 has a protrusion formed at each corner thereof, theprotrusion of the cover member 300 may be fitted into the second recess212 in the base 210.

In addition, seating recesses 215-1 and 215-2 may be formed in the uppersurface of the base 210 so that the second position sensor 240 may bedisposed in each of the seating recesses 215-1 and 215-2. In anembodiment, the base 210 may be provided in the upper surface thereofwith two seating recesses 215-1 and 215-2, in which the second positionsensors 240 may be disposed. Imaginary lines connecting the centers ofthe seating recesses 215-1 and 215-2 to the center of the base 210, mayintersect each other. Although the angle defined between the imaginarylines may be an angle of 90° by way of example, the disclosure is notlimited thereto.

For example, the seating recesses 215-1 and 215-2 in the base 210 may bedisposed at or near the centers of the respective second coils 230, orthe centers of the second coils 230 may coincide with the centers of thesecond position sensors 240.

The second coil 230 may be disposed above the circuit board 250, and thesecond position sensor 240 may be disposed under the circuit board 250.

The circuit board 250 may be disposed on the upper surface of the base210, and may have a bore corresponding to the bore of the bobbin 110,the bore of the housing 140 and/or the bore of the base 210. The outercircumferential surface of the circuit board 250 may have a shape thatcoincides with or corresponds to the upper surface of the base 210, forexample, a square shape.

The circuit board 250 may include at least one terminal rib 253, whichis bent at the upper surface thereof and is provided with a plurality ofterminals or pins 251, which receive electrical signals from theoutside.

In FIG. 12, the second coil 230 is implemented as being provided on thecircuit member 231, which is separate from the circuit board 250,without being limited thereto. In another embodiment, the second coil230 may take the form of a ring-shaped coil block, an FP coil, or acircuit pattern formed on the circuit board 250.

The second coil 230 may have through-holes 230 a formed in the circuitmember 231 so as to allow the support members 220 to extendtherethrough, or may have avoidance recesses for avoiding interferencewith the support members 220.

The second coil 230 is located above the circuit board 250 so as to beopposite the first magnet 130 disposed or secured to the housing 140.

The second coil 230 may include a plurality of optical imagestabilization (OIS) coils 230-1 to 230-4 that correspond to theplurality of first magnets 130-1 to 130-4.

Each of the plurality of OIS coils 230-1 to 230-4 may be oriented so asto correspond to or to be aligned with one of the plurality of firstmagnets.

For example, the plurality of OIS coils 230-1 to 230-4 may berespectively disposed on the four sides of the circuit board 250,without being limited thereto.

In FIG. 12, the second coil 230 includes two OIS coils 230-3 and 230-4for the second direction and two OIS coils 230-3 and 230-4 for the thirddirection, without being limited thereto. In another embodiment, thesecond coil may include one or more OIS coils for the second directionand one or more OIS coils for the third direction.

Electromagnetic force may be generated via interaction of the firstmagnets 130-1 to 130-4 and the plurality of OIS coils 230-1 to 230-4,which are arranged to be opposite each other. The housing 140 may bemoved in the second and/or third direction using the electromagneticforce, thereby performing handshake correction.

The second position sensor 240 may detect the intensity of the magneticfield of the first magnets 130-1 to 130-4 depending on the movement ofthe housing 140, and may form output signals based on the result of thedetection.

In order to detect the displacement of the housing 140 in a directionperpendicular to the optical-axis OA, the second position sensor 240 mayinclude two OIS position sensors 240 a and 240 b, which are oriented soas to intersect each other or so as to be perpendicular to each other.

A controller for a camera module or an optical device, which will bedescribed later, may detect the displacement of the housing 140 in thesecond and third directions based on the signals output from the two OISposition sensors 240 a and 240 b.

The second position sensor 240 may be embodied as a Hall sensor, or anyother sensor may be used as long as it can detect the intensity of amagnetic field. For example, each of the OIS position sensors 240 a and240 b may take the form of a driver that includes a Hall sensor, or maybe embodied as a position detection sensor alone, such as a Hall sensor.

The second position sensor 240 may be mounted on the lower surface ofthe circuit board 250, without being limited thereto.

A plurality of terminals 251 may be installed on the terminal rib 253 ofthe circuit board 250. For example, the circuit board 250 may receiveexternal power through the plurality of terminals 251 installed on theterminal rib 253, and may supply drive signals or power to the first andsecond coils 120 and 230 and the first and second position sensors 170and 240. The circuit board 250 may outwardly output signals receivedfrom the first and second position sensors 170 and 240.

In the embodiment, although the circuit board 250 may be embodied as aFlexible Printed Circuit Board (FPCB), the disclosure is not limitedthereto. The terminals 251 of the circuit board 250 may be directlyformed on the surface of the base 210 via, for example, a surfaceelectrode process.

The circuit board 250 may have through holes 250 a 1 and 250 a 2 throughwhich the support members 220 extend.

One end of each of the support members 220 may be coupled to the outerframe 152 a, 152 b or 155 of the upper elastic member 150, and the otherend of each of the support members 220 may extend through the throughholes 250 a 1 or 250 a 2 in the circuit board 250 and may beconductively connected to a circuit pattern or a pad provided on thelower surface of the circuit board 250 via solder or the like.

In another embodiment, the circuit board 250 may not have the throughholes 250 a 1 and 250 a 2 therein, and the other end of the supportmember 220 may be conductively connected to the circuit pattern or a padformed on the upper surface of the circuit board 250 via soldering orthe like.

In a further embodiment, the other end of the support member 220 mayextend through the through hole 230 in the circuit member 231, and maybe conductively connected to the circuit pattern or the pad provided onthe lower surface of the circuit member 231 via soldering or the like.

The circuit board 250 may further have a through hole 250 b, which iscoupled to an upper support protrusion 217 of the base 210. The uppersupport protrusion 217 of the base 210 and the through hole 250 b in thecircuit board 250 may be coupled to each other, as illustrated in FIG.11, and may be secured to each other via an adhesive member such asepoxy.

Next, the third coil 260 will be described.

The third coil 260 is disposed between the second position sensor 240and the second coil 230. The third coil 260 receives drive signals (forexample, drive current), and generates a magnetic field in response tothe drive signals.

For the purpose of OIS driving for handshake correction, a drive signalmay be applied to the second coil 230, and the second coil 230 may thusgenerate a magnetic field in response to the drive signal.

With respect to the second position sensor 240, the magnetic field fromthe third coil 260 and the magnetic field from the second coil 230 aregenerated in directions such that the two magnetic fields counteracteach other. For example, the magnetic field from the third coil 260detected by the second position sensor 240 and the magnetic field fromthe second coil 230 may be directed so as to counteract each other.

The second coil 230 may be disposed on the circuit board 250, the secondposition sensor 240 may be disposed under the circuit board 250, and thethird coil 260 may be provided on the circuit board 250. For example,the third coil 230 may be embodied as a metal pattern wired on thecircuit board 250.

The third coil 260 may include a first of third coil 262 a thatcorresponds to the first OIS position sensor 262 a and a second of thirdcoil 262 b that corresponds to the second OIS position sensor 262 b.

The first of third coil 262 a and the second of third coil 262 b may beconductively isolated from each other, and may be provided on thecircuit board 250 so as to be spaced apart from each other.

The third coil 260 may be conductively connected to the terminals 251 ofthe circuit board 250, and drive signals may thus be supplied to thethird coil 260 via the terminals 251 of the circuit board 250.

For example, one end of the first of third coil 262 a may beconductively connected to one of the terminals on one of the terminalribs of the circuit board 250, and the other end may be conductivelyconnected to one of the terminals on the other terminal rib of thecircuit board 250.

The second of third coil 262 b may be conductively connected to twoterminals on one of the terminal ribs of the circuit board 250.

The connection relationship between the terminals on the terminal rib ofthe circuit board 250 and the first of third and second of third coils262 a and 262 b may not be limited to the configuration illustrated inFIG. 12, and may be embodied as various configurations.

The third coil 260 illustrated in FIG. 12 is formed on the upper surfaceof the circuit board 250, without being limited thereto. In anotherembodiment, the third coil may be formed on the lower surface of thecircuit board 250. In a further embodiment, the third coil may be formedon an additional circuit member (not shown), rather than being formed onthe circuit board 250.

In yet a further embodiment, the second coil 230 may be provided on theupper surface of the circuit member 231, and the third coil 260 may beprovided on the lower surface of the circuit member 231.

The second coils 230 and the third coil 260 may be configured to have aloop shape, which is wound clockwise or counterclockwise with respect tothe optical-axis OA. The number of times the third coil 260 is wound maybe smaller than the number of times the second coil 230 is wound.

The number of times each of the first of third coil 262 a and the secondof third coil 262 b is wound may be one time or more.

The first of third coil 262 a and the second of third coil 262 b mayhave the same shape and size.

For example, each of the first or third coil 262 a and the first ofthird coil 262 b may include a first wire with one end connected to oneterminal on the circuit board 250, a second wire with one end connectedto another terminal on the circuit board 250, and a loop portionconnected to the other end of the first wire and the other end of thesecond wire and having a loop shape. Here, the loop portion may be aportion at which an induction magnetic field is generated in response toa drive signal (for example, current).

FIGS. 13a to 13e illustrate embodiments of the first of third coil 262a.

Referring to FIGS. 13a to 13e , the first of third coil 262 a 1 to 262 a5 may include the first wire 13 a-1 to 13 e-1 with one end connected toone terminal on the circuit board 250, the second wire 13 a-2 to 12 e-2with one end connected to another terminal on the circuit board 250, andthe loop portion 13 a-3 to 13 e-3 connected to the other end of thefirst wire 13 a-1 to 13 e-1 and the other end of the second wire 13 a-2to 12 e-2 and having a loop shape.

The loop portion 13 a-3 to 13 e-3 may be configured to have variousshapes. Each of the loop portions 13 a-3, 13 d-3 and 13 e-3, which areillustrated in FIGS. 13a, 13d and 13e , may have a rectangular shape,the loop portion 13 b-3 illustrated in FIG. 13b may have a circularshape, and the loop portion 13 c-3 illustrated in FIG. 13c may have anelliptical shape, without being limited thereto. In other embodiments,the loop portion may have a polygonal shape.

The first wire 13 a-1 to 13 c-1 and 13 e-1 and the second wire 13 a-2 to13 c-2 and 13 e-2 may extend in opposite directions, as illustrated inFIGS. 13a to 13c and FIG. 13e , and the first wire 13 d-1 and the secondwire 13 d-2 may extend in the same direction, as illustrated in FIG. 13d.

The point at which the other end of the first wire 13 a-1 to 13 e-1 isconnected to one end of the loop portion 13 a-3 to 13 e-3 and the pointat which the other end of the second wire 13 a-2 to 13 e-2 is connectedto the other end of the loop portion 13 a-3 to 13 e-3 may be spacedapart from each other by a predetermined distance d1.

For example, d1 may range from 5 μm to 1000 μm.

If d1 is smaller than 5 μm, it is not easy to perform a patterningprocess for formation of the third coil. If d1 is greater than 1000 μm,the desired intensity of a magnetic field from the third coil 262 a 1 to262 a 5 may not be obtained. In order to ensure ease of a patterningprocess, d1 may range from 5 μm to 1000 μm.

In another embodiment, the loop portion may be embodied in such a mannerthat the first wire and the second wire intersect each other.

The loop portion 13 a-3 to 13 e-3 of the third coil 260 may include afirst region that overlaps the second coil 230-2 or 230-3 in theoptical-axis direction OA and a second region that does not overlap thesecond coil 230-2 or 230-3. The second region may overlap the OISposition sensor 240 a and 240 b at at least part thereof.

The diameter or width of the loop portion 13 a-3 to 13 e-3 of the thirdcoil 260 in the second direction (for example, in the X-axis direction)may be smaller than or equal to the diameter or width of the OISposition sensor 240 a in the second direction (for example, in theX-axis direction), without being limited thereto. In another embodiment,the diameter or width of the loop portion 13 a-3 to 13 e-3 of the thirdcoil 260 in the second direction (for example, in the X-axis direction)may be greater than the diameter or width of the OIS position sensor 240a in the second direction (for example, in the X-axis direction).

The length of the second region of the loop portion 13 a-3 to 13 e-3 ofthe third coil 260 in the third direction (for example, in the Y-axisdirection) may be greater than or equal to the length of the firstregion of the loop portion 13 a-3 to 13 e-3 of the third coil 260 in thethird direction, without being limited thereto. In another embodiment,the length of the second region in the third direction may be smallerthan the length of the first region in the third direction.

The loop portion 13 a-3 to 13 d-3 of the third coil illustrated in FIGS.13a to 13d has a loop, which is configured to have a single pattern or awinding of one turn. In order to counteract the intensity of a magneticfield of the second coil 230 so as to improve the reliability of OISfeedback control by output of the second position sensor 240, the loopportion 13 c-3 of the third coil 262 a 5 illustrated in FIG. 13e may bea loop that is configured to have a plurality of patterns or a windingof two or more turns. Here, the number of times the wire of the loop iswound may be limited within a range in which OIS drive by theinteraction between the second coil 230 and the magnet 130 is notlimited or interrupted.

For example, the number of times the third coil 262 a 5 is wound may betwo to five times. In another embodiment, the number of times the thirdcoil 262 a 5 is wound may be six to ten times. In a further embodiment,the number of times the third coil 262 a 5 is wound may be eleven timesto fifteen times. The number of times the third coil is wound may beinversely proportional to the size of the region P2 or P4 of the thirdcoil that overlaps the second coil 230 in the optical-axis direction OA.For example, when the size of the region P2 or P4 (see FIGS. 17a and 17b) of the third coil 262 a 5 that overlaps the second coil 230 in theoptical-axis direction OA is increased, the intensity of a magneticfield of the second coil 230 is counteracted, and the reliability of OISfeedback control is improved even when the number of times the thirdcoil 262 a 5 is wound is reduced.

Although the loop portion 13 e-3 is configured to have a rectangularshape in FIG. 13e , the disclosure is not limited thereto. The loopportion may be configured to have a polygonal shape, rather than acircular, elliptical or rectangular shape.

In another embodiment, the number of times the loop portion 13 e-3illustrated in FIG. 13e is wound may be once, and the loop portion 13e-3 may be configured such that a portion thereof intersects anotherportion thereof.

FIG. 14 illustrates the relative positional relationship among the firstmagnet 130-2, the second coil 230-2, the first of third coil 262 a andthe first OIS position sensor 240 a, which are aligned with one another.

Referring to FIG. 14, at least part of the third coil 260 may overlapthe second position sensor 240 in the optical-axis direction OA.Furthermore, at least part of the third coil 260 may overlap the secondcoil 230 in the optical-axis direction OA.

For example, at least part of each of the first of third and second ofthird coils 262 a and 262 b may overlap a corresponding one of the firstand second OIS position sensors 240 a and 240 b in the optical-axisdirection OA.

Furthermore, at least part of each of the first of third and second ofthird coils 262 a and 262 b may overlap a corresponding one of the OIScoils 230-1 to 230-4 in the optical-axis direction OA.

The centers of the first magnet 130-2 or 130-3, the second coil 230-2 or230-3 and the OIS position sensor 240 a or 240 b, which are aligned withone another, may be aligned with a first central line 14 a in theoptical-axis direction OA. For example, the first central line may beparallel to the optical-axis OA, and may be an imaginary straight linethat extends through the centers of the first magnet 130-2 or 130-3, thesecond coil 230-2 or 230-3 and the OIS position sensor 240 a or 240 b,which are aligned with one another.

The centers of the first magnet 130-2 or 130-3, the second coil 230-2 or230-3 and the OIS position sensor 240 a or 240 b, which are aligned withone another, may be overlapped with a second central line 14 b in theoptical-axis direction OA.

For example, the second central line 14 b may be an imaginary straightline, which is perpendicular to the optical-axis, parallel to the thirddirection (for example, the Y-axis direction) and perpendicular to thefirst central line 14 a and which extends through the center of the loopportion of the third coil 262 a. For example, the second coil 230-2 or230-3 may be symmetric with respect to the second central line 14 b. Thecenter of the OIS position sensor 240 a or 240 b may be located at thecenter of a sensing element adapted to detect electromagnetic force ofthe second coil 230-2 or 230-3.

In FIG. 14, B1 represents the direction of a magnetic field of the firstmagnet, B2 represents the direction of an induction magnetic field ofthe first OIS coil 230-2 generated by first drive current IS1, and B3represents the direction of an induction magnetic field of the first ofthird coil 262 a generated by second drive current IS2.

For example, the direction in which the first drive current IS1 flowsand the direction in which the second drive current IS2 flows may beopposite each other, and the direction of the induction magnetic fieldof the first OIS coil 230-2 and the direction of the induction magneticfield of the first of third coil 262 a may be opposite each other.

FIG. 15 illustrates one example of the direction of a magnetic field ofthe first magnet 130-2, the second coil 230-2 and the first of thirdcoil 262 a, which are aligned with one another, and FIG. 16 illustratesanother example of the direction of a magnetic field of the first magnet130-2, the second coil 230-2 and the first of third coil 262 a, whichare aligned with one another.

Referring to FIGS. 15 and 16, the direction of a magnetic field B2induced by the second coil 230-2 and the direction of a magnetic fieldB3 of the first of third coil 262 a may be oriented so as to counteracteach other, that is, so as to be opposite each other. For example, thefirst drive current applied to the second coil 230-2 and the seconddrive current applied to the first of third coil 262 a may flow inopposite directions.

Here, the intensity of the magnetic field B3 induced by the first ofthird coil 262 a may be lower than the intensity of the magnetic fieldB2 induced by the second coil 230-2. If the intensity of the magneticfield B3 induced by the first of third coil 262 a is equal to or higherthan the intensity of the magnetic field B2 induced by the second coil230-2, the compensation by the magnetic field induced by the first ofthird coil 262 a is overly increased, and it is thus impossible toobtain electromagnetic force having a desired direction or intensitybetween the first magnet 130 and the second coil 230.

The first and second OIS position sensors 240 a and 240 b may detect theintensity of the magnetic field of the first magnets 130-1 to 130-4.Here, since the second coils 230-2 and 230-3 and the OIS positionsensors 240 a and 240 b are positioned so as to be adjacent to eachother, the OIS position sensors 240 a and 240 b may be influenced by themagnetic field induced by the second coils 230-2 and 230-3.

Owing to the influence of the induction magnetic field generated by thesecond coils 230-2 and 230-3, the OIS position sensors 240 a and 240 bcannot accurately detect variation in the intensity of magnetic force ofthe first magnet 130 depending on movement of the housing 140, therebydeteriorating the reliability of handshake correction.

Performance and stability of OIS control for handshake correction may beverified through analysis of frequency response properties using afrequency response analyzer (FRA), for example, analysis of a gainmargin and a phase margin.

For example, it is possible to measure the degree of performance of OISfeedback control using a suppression ratio. For example, the suppressionratio may be defined by a value of log (20 log(Y)) of a ratio(Y=OUTPUT/INPUT) of an output signal (OUT) of the OIS position sensor toan input signal (INPUT) applied to the second coil.

According to the frequency response property based on the suppressionratio of the OIS position sensor, the gain is increased in a frequencyrange higher than the second resonant frequency, and the gain margin maythus be decreased due to the influence of a magnetic field of the secondcoil by magnetic induction. The decrease in the gain margin of thefrequency response property by the suppression ratio of the OIS positionsensor may cause oscillation and deterioration in stability of OISfeedback control.

By providing the third coil (for example, 262 a) adapted to generate themagnetic field B3, which is directed so as to counteract the magneticfield B2 induced by the second coil (for example, 230-2), the embodimentis able to prevent a decrease in the gain margin in a frequency rangehigher than the second resonant frequency, and is able to ensure thestability of OIS feedback control and reliability of handshakecorrection.

FIGS. 17a and 17b illustrate schematic views showing an outputexperiment of the OIS position sensor depending on the shape anddisposition of the first of third coil, and FIG. 17c illustrates asimulation experiment result obtained through the experiment of FIGS.17a and 17b . In FIG. 17c , the X axis represents time, wherein the unitis second, and the Y axis represents the output of the OIS positionsensor, wherein the unit is mV.

Referring to FIG. 17a , the loop portion 13 a′ of the first of thirdcoil 262 a′ may include a first region P1, which overlaps the secondcoil 230-2 in the optical-axis direction OS, and a second region P2,which does not overlap the second coil 230-2 in the optical-axisdirection.

The first region P1 overlaps the OIS position sensor 240 a in theoptical-axis direction whereas the second region P2 does not overlap theOIS position sensor 240 a in the optical-axis direction.

For example, the first region P1 may include a first portion thatoverlaps the OIS position sensor 240 a and a second portion that doesnot overlap the OIS position sensor.

The diameter or width of the loop portion 13 a′ of the first of thirdcoil 262 a′ in the second direction (for example, in the X-axisdirection) may be smaller than the diameter or width of the OIS positionsensor 240 a in the second direction. For example, the second directionmay be parallel to the longitudinal direction of the second coil 230.

The length D1 of the first region P1 in the second direction is smallerthan the diameter of the OIS position sensor 240 a in the seconddirection (D1<D2).

The length L12 of the second region P2 in the third direction (forexample, in the Y-axis direction) is longer than the length L11 of thefirst region P1 in the third direction (L12>L11). For example, the thirddirection may be perpendicular to the longitudinal direction of thesecond coil 230.

The diameter of the loop portion 13 a′ of the first of third coil 262 a′in the second direction is smaller than the diameter of the OIS coil230-2 in the second direction.

The length D1 of the first region P1 in the second direction is shorterthan the length L21 of the OIS coil 230-2 in the second direction(D1<L21).

The length L11 of the first region P1 in the third direction is shorterthan the length L22 of the OIS coil 230-2 in the third direction(L11<L22).

The second region P2 may be located closer to the reference line than isthe first region P1. The reference line may be an imaginary straightline that extends through the center of the housing 140 and is parallelto the optical-axis. For example, the reference line may be theoptical-axis OA illustrated in FIG. 12.

Referring to FIG. 17b , the loop portion 13 a″ of the first of thirdcoil 262 a″ may include a third region P3 that overlaps the second coil230-2 in the optical-axis direction OA, and a fourth region P4 that doesnot overlap the second coil 230-2 in the optical-axis direction. Thethird region P3 does not overlap the OIS position sensor 240 a in theoptical-axis direction, and the fourth region P4 does not overlap theOIS position sensor 240 a in the optical-axis direction. For example,the third region P3 may include a third portion that overlaps the OISposition sensor 240 a and a fourth portion that does not overlap the OISposition sensor.

The diameter or width of the loop portion 13 a″ of the first of thirdcoil 262 a″ in the second direction may be equal to the diameter orwidth of the OIS position sensor 240 a in the second direction.

The length D3 of the third region P3 in the second direction may beequal to the diameter D2 of the OIS position sensor 240 a in the seconddirection.

The length L14 of the fourth region P4 in the third direction is longerthan the length L13 of the third region P3 in the third direction(L14>L13).

The length L14 of the fourth region P4 illustrated in FIG. 17b in thethird direction may be longer than the length of the second region P2illustrated in FIG. 17a in the third direction (L14>L12). g3 is closerto Ref than g2 is. Therefore, it is possible to further improve thereliability of OIS feedback control by the OIS position sensor 240 a.

The diameter of the loop portion 13 a″ of the first of third coil 262 a″in the second direction is smaller than the diameter of the OIS coil230-2 in the second direction.

The length D3 of the third region P3 in the second direction is smallerthan the length L21 of the OIS coil 230-2 in the second direction(D3<L21).

The length L14 of the third region P3 in the third direction is smallerthan the length L22 of the OIS coil 230-2 in the third direction(L14<L22).

The fourth region P4 may be located closer to the reference line (forexample, the optical-axis OA) than the third region P3 is.

The ratio (L11:L12) of the length L11 of the first region P1 and thelength L12 of the second region P2 in the third direction or the ratio(L13:L14) of the length L13 of the third region P3 and the length L14 ofthe fourth region P4 may be 1:2-1:4. In another embodiment, the ratio(L11:L12) of L11 and L12 or the ratio (L13:L14) of L13 and L14 may be1:2.4-1:2.8, without being limited thereto.

Referring to FIG. 17c , Ref represents the output of the OIS positionsensor 240 a with the result of detection of the intensity of a magneticfield of the first magnet 130 in the state in which the second coil 230and the third coil 260 are not provided. Ref represents the resultobtained under the condition in which the OIS position sensor 240 a isnot at all affected by a magnetic field of the second coil 230.

g1 represents output of the OIS position sensor 240 a under thecondition in which the second coil 230 is provided but the third coil260 is not provided. Here, the output of the OIS position sensor 240 ais different from Ref due to the influence of a magnetic field generatedby the second coil 230.

g2 and g3 represent output of the OIS position sensor 240 a under thecondition in which the third coil 260 according to the embodiment isprovided. g2 represents the output of the OIS position sensor 240 a inthe case of FIG. 17a , and g3 represents the output of the OIS positionsensor 240 a in the case of FIG. 17 b.

Compared to the output of the OIS position sensor 240 a in g1, theoutput of the OIS position sensor 240 a in g2 and g3 is closer to Ref.

The embodiment is able to diminish the influence of the magnetic fieldof the second coil 230, which affects the output of the OIS positionsensor 240, using a magnetic field generated by the third coil 260.Furthermore, the embodiment is able to cause the output of the OISposition sensor 240 to be close to the reference value (for example,Ref) using the third coil 260, with the result that it is possible toprevent a decrease in the gain margin of a frequency response propertyby the suppression ratio of the OIS position sensor in a frequency rangehigher than the second resonant frequency and is possible to ensure thestability of OIS feedback control and reliability of handshakecorrection.

FIG. 18 is a perspective view of a lens moving apparatus according toanother embodiment. FIG. 19 is an exploded perspective view of the lensmoving apparatus shown in FIG. 18. FIG. 20 is a cross-sectional viewshowing part of the lens moving apparatus shown in FIG. 19. FIG. 21 is across-sectional view of the lens moving apparatus shown in FIG. 18. FIG.22 is a perspective view showing part of the lens moving apparatus shownin FIG. 20.

Referring to FIGS. 18 to 22, the lens moving apparatus may include acover member 1100, a first movable unit 1200, a second movable unit1300, a stationary unit 1400, a base 1500, support members 1600 and asensor unit (not shown). However, one or more of the cover member 1100,the first movable unit 1200, the second movable unit 1300, thestationary unit 1400, the base 1500, the support members 1600 and thesensor unit may be omitted in the lens moving apparatus shown in FIGS.18 to 22. Particularly, the sensor unit, which is intended to performfunctions of autofocus feedback and/or handshake correction feedback,may be omitted.

The cover member 1100 may accommodate a housing 1310 and a bobbin 1210in the internal space thereof. The cover member 1100 may be coupled tothe base 1500. The cover member 100 may define the appearance of thelens moving apparatus. The cover member 1100 may be configured to havethe shape of a rectangular parallelepiped having an open bottom, withoutbeing limited thereto.

The cover member 1100 may be made of, for example, metal. Morespecifically, the cover member 110 may be made of a metal plate. In thiscase, the cover member 110 may shield the interior againstelectromagnetic interference (EMI). Owing to these characteristics ofthe cover member 1100, the cover member 1100 may be referred as an EMIshield can. The cover member 1100 may prevent electric waves, which aregenerated outside the lens moving apparatus, from being introducedthereinto. Furthermore, the cover member 1100 may prevent electricwaves, which are generated inside the cover member 1100, from beingemitted outside. However, the material of the cover member 1100 is notlimited to the above-mentioned material.

The cover member 110 may include a top plate 1101, a side plate 1102 anda round portion 1103. The cover member 1100 may include the side plate1102, which is coupled at the lower end thereof to the base 1500. Thecover member 1100 may include the top plate 1101, which is positionedabove the housing 1310. The cover member 1100 may include the roundportion 1103, which connects the side plate 1102 to the top plate 1101and has a round shape. The lower end of the side plate 1102 of the covermember 1100 may be mounted on the base 1500. The cover member 1100 maybe mounted on the base 1500 such that the inner surface of the covermember 1100 comes into close contact with a partial area or the entirearea of the side surface of the base 1500. The first movable unit 1200,the second movable unit 1300, the stationary unit 1400 and the supportmembers 1600 may be positioned in the internal space defined by thecover member 1100 and the base 1500. By virtue of this configuration,the cover member 100 is able to protect the internal components fromexternal shocks and to prevent the entry of external contaminants.However, the embodiment is not limited to the above configuration, andthe lower end of the side plate 1102 of the cover member 1100 may bedirectly coupled to the printed circuit board of the camera module,which is positioned under the base 1500.

The cover member 1100 may include an opening 1110, which is formed inthe top plate 1101 so as to expose the lens module. The opening 1110 maybe configured to have a shape corresponding to the lens module. The sizeof the opening 1110 may be larger than the diameter of the lens moduleso as to allow the lens module to be mounted through the opening 1110.Light, which is introduced through the opening 1110, may pass throughthe lens module. Here, the light having passed through the lens modulemay be obtained as an image at an image sensor.

The first movable unit 1200 may include a bobbin 1210 and an AF coilunit 1220. The first movable unit 1200 may include the bobbin 1210,which is coupled to the lens module. The first movable unit 1200 mayinclude the AF coil unit 1220, which is positioned at the bobbin 1210and which is moved by the electromagnetic interaction with a drivemagnet unit 1320.

The bobbin 1210 may be coupled to the lens module. More specifically,the outer circumferential surface of the lens module may be coupled tothe inner circumferential surface of the bobbin 1210. The AF coil unit1220 may be positioned at the bobbin 1210. The AF coil unit 1220 may becoupled to the bobbin 1210. An upper elastic member 1610 may be coupledto an upper portion of the bobbin 1210. The bobbin 1210 may bepositioned inside the housing 1310. The bobbin 1210 may move in theoptical-axis direction relative to the housing 1310.

The bobbin 1210 may include a lens-accommodating portion 1211, a firstdrive-coupling portion 1212, an upper coupling portion 1213, a lowercoupling portion (not shown) and a protrusion 1215.

The bobbin 1210 may include the lens-accommodating portion 1211 havingan open top and an open bottom. The bobbin 1210 may include thelens-accommodating portion 1211 formed therein. The lens module may becoupled to the lens-accommodating portion 1211. The lens-accommodatingportion 1211 may be provided on the inner circumferential surfacethereof with a threaded portion that corresponds to a threaded portionformed on the outer circumferential surface of the lens module. In otherwords, the lens-accommodating portion 1211 may be threadedly coupled tothe lens module. An adhesive is disposed between the lens module and thebobbin 1210. Here, the adhesive may be epoxy, which is hardened byultraviolet or heat. In other words, the lens module and the bobbin 1210may be bonded to each other via ultraviolet hardening epoxy and/orthermohardening epoxy.

The bobbin 1210 may include the first drive-coupling portion 1212, onwhich the AF coil unit 1220 is disposed. The first drive-couplingportion 1212 may be integrally formed with the outer surface of thebobbin 1210. The first drive-coupling portion 1212 may be continuouslyformed along the outer surface of the bobbin 1210 or may beintermittently formed along the outer surface of the bobbin 1210 atpredetermined intervals. For example, the first drive-coupling portion1212 may be configured to have a recess, which is formed by depressingpart of the outer surface of the bobbin 1210 so as to correspond to theshape of the AF coil unit 1220. Here, the AF coil unit 1220 may bedirectly wound around the first drive-coupling portion 1212. In amodification, the first drive-coupling portion 1212 may be open at thetop or bottom thereof. Here, the AF coil unit 1220 may be fitted intothe first drive-coupling portion 1212 through a coil-ring-shapedopening.

The bobbin 1210 may include an upper coupling portion 1213, which iscoupled to the upper elastic member 1610. The upper coupling portion1213 may be coupled to the inner frame 1612 of the upper elastic member1610. For example, the protrusion (not shown) of the upper couplingportion 1213 may be fitted into and coupled to a groove or hole (notshown) in the first inner frame 1612 of the upper elastic member 1610.Here, the protrusion of the upper coupling portion may be fitted intothe inner frame 1612 of the upper elastic member 1610 and thermallyfused thereto, thereby securing the upper elastic member 1610.

The bobbin 1210 may include a lower coupling portion (not shown), whichis coupled to the lower elastic member 1620. The lower coupling portionmay be coupled to the inner frame 1622 of the lower elastic member 1620.For example, the protrusion (not shown) of the lower coupling portionmay be fitted into and coupled to a groove or hole (not shown) in theinner frame 1622 of the lower elastic member 1620. Here, the protrusionof the lower coupling portion may be fitted into the inner frame 1622 ofthe lower elastic member 1620 and thermally fused thereto, therebysecuring the lower elastic member 1620.

The bobbin 1210 may include the protrusion 1215 projecting upwards fromthe upper surface of the bobbin 1210. The protrusion 1215 may projectupwards from the upper surface of the bobbin 1210. The protrusion 1215may be constituted by four protrusions, without being limited thereto. Asecond damper may be applied to the protrusion 1215. Part of the upperelastic member 1610 may be configured so as not to interfere with theprotrusion 1215.

Among the AF coil unit 1220, the drive magnet unit 1320 and the OIS coilunit 1420, one may be referred to as a ‘first drive part’, another maybe referred to as a ‘second drive part’, and the remaining one may bereferred to as a ‘third drive part’. Although the embodiment has beendescribed as being configured such that the AF coil unit 1220 ispositioned at the bobbin 1210, the drive magnet unit 1320 is positionedat the housing 1310 and the OIS coil unit 1420 is positioned at the base1500, the positions of the AF coil unit 1220, the drive magnet unit 1320and the OIS coil unit 1420 may be exchanged with one another.Furthermore, one or more of the coil units 1220 and 1420 may be replacedwith an additional magnet part. In other words, the first to third driveparts may be designed to have any configuration as long aselectromagnetic interaction among the first to third drive parts can beperformed. One of the AF coil unit 1220 and the OIS coil unit 1420 maybe referred to as a ‘first coil unit’ or a ‘first coil’, and the otherthereof may be referred to as a ‘second coil unit’ or a ‘second coil’.

The AF coil unit 1220 may be guided by the first drive-coupling portion1212 and may be wound around the outer surface of the bobbin 1210. Inanother embodiment, the AF coil unit 1220 may include four independentcoils, and two adjacent coils, among the four coils, may be disposed onthe outer surface of the bobbin 1210 so as to define an angle of 90degrees therebetween. The AF coil unit 1220 may face the drive magnetunit 1320. The AF coil unit 1220 may be disposed so as to performelectromagnetic interaction with the drive magnet unit 1320. The AF coilunit 1220 may move the bobbin 1210 with respect to the housing 1310 viaelectromagnetic interaction.

The AF coil unit 1220 may include a pair of lead wires (not shown) forthe supply of power. Here, the pair of lead wires of the AF coil unit1220 may be conductively connected to first and second upper elasticmembers 1616 and 1617, which are components of the upper elastic member1610.

In other words, the AF coil unit 1220 may be supplied with power throughthe upper elastic member 1610. By virtue of this configuration, whenpower is supplied to the AF coil unit 1220, an electromagnetic field maybe formed around the AF coil unit 1220.

The second movable unit 1300 may move to fulfill a function of handshakecorrection. The second movable unit 1300 may be positioned outside thefirst movable unit 1200 so as to face the first movable unit 1200. Thesecond movable unit 1300 may move the first movable unit 1200 or maymove along with the first movable unit 1200. The second movable unit1300 may be movably supported by the stationary unit 1400 and/or thebase 1500. The second movable unit 1300 may be positioned in theinternal space of the cover member 1100.

The second movable unit 1300 may include the housing 1310 and the drivemagnet unit 1320. The second movable unit 1300 may include the housing1310, which is positioned outside the bobbin 1210. The second movableunit 1300 may include the drive magnet unit 1320, which is positioned soas to face the housing 1310 and is fixed to the housing 1310.

The housing 1310 may include a first side surface 1301, a second sidesurface 1302 adjacent to the first side surface 1301, and a cornerportion 1305 positioned between the first side surface 1301 and thesecond side surface 1302. The housing 1301 may include first to fourthside surfaces 1301 to 1304, which are continuously positioned, andcorner portions 1305 to 1308, which are positioned between the first tofourth side surfaces 1301 to 1304.

At least part of the housing 1310 may be configured to have a shapecorresponding to the inner surface of the cover member 1100.Particularly, the outer surface of the housing 1310 may be configured tohave a shape corresponding to the inner surface of the side plate 1102of the cover member 1100. For example, the housing may be configured tohave the shape of a rectangular parallelepiped having four sidesurfaces. However, the housing 1310 may be configured to have any shape,as long as the housing 1310 can be disposed in the cover member 100. Thehousing 1310 may be made of an insulating material, and may be made ofan injection-molded product in consideration of productivity.

The housing 1310 may be positioned outside the bobbin 1210. The drivemagnet unit 1320 may be positioned at the housing 1310. The housing 1310may be positioned above the base 1500. The housing 1310, which is a partadapted to be moved for the OIS drive, may be disposed so as to bespaced apart from the cover member 1100 by a predetermined distance.However, the housing 1310 may be fixed to the base 1500 in an AF model.Alternatively, the housing 1310 may be omitted, and the drive magnetunit 1320 may be fixed to the cover member 1100 in the AF model. Theupper elastic member 1610 may be coupled to an upper portion of thehousing 1310.

The housing 1310 may include an internal space 1311, a seconddrive-coupling portion 1312, an upper coupling portion 1313, a lowercoupling portion (not shown), a protrusion 1330, an upper stopper 1340and a support member recess 1350.

The housing 1310 is open at the upper and lower sides thereof such thatthe first movable unit 1200 is accommodated in the housing 1310 and ismoved up and down. The housing 1310 may include therein the internalspace 1311, which is open at the upper and lower sides thereof. Thebobbin 1210 may be movably disposed in the internal space 1311. In otherwords, the internal space 1311 may be configured to have a shapecorresponding to that of the bobbin 1210. The inner circumferentialsurface of the housing 1310, which defines the internal space 1311, maybe positioned so as to be spaced apart from the outer circumferentialsurface of the bobbin 1210.

The housing 1310 may include the second drive-coupling portion 1312formed on the side surface thereof, which is configured to have a shapecorresponding to the drive magnet unit 1320 so as to accommodate thedrive magnet unit 1320. The second drive-coupling portion 1312 mayaccommodate the drive magnet unit 1320 and may secure the drive magnetunit 1320.

The drive magnet unit 1320 may be secured to the second drive-couplingportion 1312 via an adhesive (not shown). The second drive-couplingportion 1312 may be positioned on the inner circumferential surface ofthe housing 1310. In this case, this configuration gives an advantage toelectromagnetic interaction with the AF coil unit 1220, which ispositioned inside the drive magnet unit 1320. For example, the seconddrive-coupling portion 1312 may be configured to be open at the lowerside thereof. In this case, this configuration gives an advantage toelectromagnetic interaction between the drive magnet unit 1320 and theOIS coil unit 1420 positioned under the drive magnet unit 1320. Forexample, the second drive-coupling portion 1312 may be constituted byfour second drive-coupling portions. The drive magnet unit 1320 may becoupled to each of the four second drive-coupling portions 1312. Thesecond drive-coupling portions 1312 may be respectively formed on thefirst to fourth corner portions 1305 to 1308, at which adjacent sidesurfaces of the housing 1310 adjoin each other. Alternatively, thesecond drive-coupling portions 1312 may be respectively formed on thefirst to fourth side surfaces 1301 to 1304 of the housing 1310.

The housing 1310 may include the upper coupling portion 1313, which iscoupled to the upper elastic member 1610. The upper coupling portion1313 may be coupled to a first outer frame 1611 of the upper elasticmember 1610. For example, the protrusion of the upper coupling portion1313 may be fitted into and coupled to a groove or hole (not shown) inthe first outer frame 1611 of the upper elastic member 1610. Here, theprotrusion of the upper coupling portion 1313 may be fitted into thehole in the first outer frame 1611 and may be thermally fused thereto,thereby securing the upper elastic member 1610.

The housing 1310 may include the lower coupling portion, which iscoupled to the lower elastic member 1620. The lower coupling portion maybe coupled to a second outer frame 1621 of the lower elastic member1620. For example, the protrusion of the lower coupling portion may befitted into and coupled to a groove or hole (not shown) in the secondouter frame 1621 of the lower elastic member 1620. Here, the protrusionof the lower coupling portion may be fitted into the hole in the secondouter frame 1621 and may be thermally fused thereto, thereby securingthe lower elastic member 1620.

The housing 1310 may include the protrusion 1330, which extends upwardsfrom the upper surface thereof and which is positioned outside the upperelastic member 1610. The protrusion 1330 may extend upwards from theupper surface. The protrusion 1330 may be positioned outside the upperelastic member 1610. The protrusion 1330 may be positioned on at leastone of the first to fourth corner portions 1305 to 1308 of the housing1310. The protrusion 1330 may overlap the upper elastic member 1610 in adirection perpendicular to the optical-axis of the lens module, which iscoupled to the bobbin 1210. In other words, the protrusion 1330 mayoverlap the upper elastic member 1610 in a horizontal direction.

By virtue of this configuration, the protrusion 1330 is able to preventthe upper elastic member 1610 from being exposed to the outside in adiagonal direction. In other words, even when a worker grasps the upperportion of the housing 1310, to which the upper elastic member 1610 iscoupled, in a diagonal direction, the protrusion 330 of the housing1310, rather than the upper elastic member 1610, is grasped, therebypreventing the upper elastic member 1610 from being deformed due tocontact with the worker.

The protrusions 1330 may include a first protrusion 1331, positioned atthe first corner portion 1305, a second protrusion 1332, positioned atthe second corner portion 1306, a third protrusion 1333, positioned atthe third corner portion 1307, and a fourth protrusion 1334, positionedat the fourth corner portion 1308. Here, a first imaginary line, whichconnects the center of the first protrusion 1331 to the center of thethird protrusion 1333, may be orthogonal to a second imaginary line,which connects the center of the second protrusion 1332 to the center ofthe fourth protrusion 1334, at the center of the housing 1310. In otherwords, the first to fourth protrusions 1331 to 1334 may be symmetricallypositioned with the center of the housing 1310.

The protrusion 1330 may be positioned outside the upper stopper 1340.The upper end of the protrusion 1330 may be positioned so as to be lowerthan the upper end of the upper stopper 1340 but higher than the upperelastic member 1610. The protrusion 1330 may overlap the round portion1103 of the cover member 1100 in the optical-axis direction of the lensmodule coupled to the bobbin 1210.

In other words, the protrusion 1330 may overlap the round portion 1103of the cover member 1100 in the up-and-down direction. In other words,the protrusion 1330 may overlap the round portion 103 of the covermember 1100 in the vertical direction. The upper stopper 1340 mayoverlap the top plate 1101 of the cover member 1100 in the optical-axisdirection. In other words, the upper stopper 1340 may not overlap theround portion 1103 in the optical-axis direction. In other words, theupper stopper 1340 may not overlap the round portion 1103 in theoptical-axis direction. By virtue of this configuration, when thehousing 1310 is moved fully upwards, the upper stopper 1340, rather thanthe protrusion 1330, may come into contact with the inner side surfaceof the top plate 1101 of the cover member 1100.

If the height of the protrusion 1330 corresponds to or is equal to theheight of the upper stopper 1340, the protrusion 1330 first comes intocontact with the round portion 1103 of the cover member 1100 before theupper stopper 1340 comes into contact with the inner surface of the topplate 1101 of the cover member 1100. In this case, there is a problem inthat the outer portion of the protrusion 1330 is ground while movingalong the round portion 1103, thereby generating contaminants. In otherwords, the embodiment is constructed such that the upper stopper 1340,rather than the protrusion 1330, comes into contact with the covermember 1100, thereby preventing the generation of contaminantsattributable to grinding of the protrusion 1330.

The protrusion 1330 is configured such that the upper elastic member1610 and the soldering initiation portion of the support member 1630 areshielded when the lens moving apparatus is viewed in a diagonaldirection (at an angle of 45 degrees with respect to the side surface).

The protrusion 1330 may be positioned outside the upper stopper 1340.The upper end of the protrusion 1330 may be positioned so as to be lowerthan the upper end of the upper stopper 1340.

In other words, the upper end of the upper stopper 1340 may serve as thetop end of the housing 1310. By virtue of this configuration, when thehousing 1310 is moved upward due to external force, the upper stopper1340 may come into contact with the cover member 1100, whereby themovement of the housing 1310 is restricted.

In a modification, the protrusion 1330 may be integrally formed with theupper stopper 1340. In other words, the upper stopper 1340 may beomitted. In this case, the upper end of the protrusion 1330 may serve asthe top end of the housing 1310.

The housing 1310 may include the upper stopper 1340, which extendsupwards from the upper surface thereof and which is positioned insidethe protrusion 1330. The upper stopper 1340 may extend upwards from theupper surface of the housing 1310. The upper stopper 1340 may bepositioned inside the protrusion 1330. The upper stopper 1340 mayoverlap the cover member 1100 in the optical-axis direction. By virtueof this configuration, when the housing 1310 is moved upwards, the upperstopper 1340 may come into contact with the cover member 1100, wherebythe movement of the housing 1310 is restricted. In other words, theupper stopper 1340 may be a structure adapted to mechanically restrictthe upper limit of movement of the housing 1310.

The housing 1310 may include the support member recess 1350, whichaccommodates the support member 1630 and which is positioned inside theprotrusion 1330. The support member recess 1350 may be formed bydepressing part of the inner surface of the housing 1310 inwards. Thesupport member recess 1350 may accommodate the support member 1630. Thesupport member recess 1350 may be positioned inside the protrusion 1330.

The size of the support member recess 1350 may be smaller at a portionat which the stepped portion 1360 is formed than at the upper end of thesupport member recess 1350. In other words, the size of a portion of thesupport member recess 1350 in a horizontal direction may be reduced dueto the stepped portion 1360. By virtue of this configuration, it ispossible to prevent the first damper, which is introduced into thesupport member recess 1350, from flowing downwards.

The drive magnet unit 1320 may face the AF coil unit 1220. The drivemagnet unit 1320 may move the AF coil unit 1220 via the electromagneticinteraction with the AF coil unit 1220. The drive magnet unit 1320 maybe positioned at the housing 1310. The drive magnet unit 1320 may befixed to the second drive-coupling portion 1312 of the housing 1310. Thedrive magnet unit 1320 may include four independent magnets, which aredisposed at the housing 1310 such that two adjacent magnets define anangle of 90 degrees therebetween. In other words, the drive magnet unit1320 is able to realize efficient utilization of the internal space ofthe housing 1310 by means of magnets, which are mounted on the four sidesurfaces of the housing 1310 at regular intervals. The drive magnet unit1320 may be bonded to the housing 1310 via an adhesive, without beinglimited thereto.

The stationary unit 1400 may be positioned at the base 1500. Thestationary unit 1400 may be positioned under the second movable unit1300. The stationary unit 1400 may face the second movable unit 1300.The stationary unit 1400 may support the second movable unit 1300 in amovable manner. The stationary unit 1400 may move the second movableunit 1300. Here, the first movable unit 1200 may also be moved togetherwith the second movable unit 1300. The stationary unit 1400 may beprovided in the center thereof with through holes 1411 and 1421, whichcorrespond to the lens module.

For example, the stationary unit 1400 may include a circuit board 1410and an OIS coil unit 420. The stationary unit 1400 may include thecircuit board 1410, which is positioned between the OIS coil unit 420and the base 1500. The stationary unit 1400 may include the OIS coilunit 420, which faces the drive magnet unit 1320.

The circuit board 1410 may include a flexible printed circuit board. Thebase 1410 may be positioned between the base 1500 and the housing 1310.The circuit board 1410 may be positioned between the OIS coil unit 1420and the base 1500. The circuit board 1410 may supply power to the OIScoil unit 1420. The circuit board 1410 may supply power to the AF coilunit 1220. For example, the circuit board 1410 may supply power to theAF coil unit 1220 via the support member 1630 and the upper elasticmember 1610. Furthermore, the circuit board 1410 may supply power to theAF sensor unit via the support member 1630 and the upper elastic member1610.

For example, the circuit board 1410 may include the through hole 1411and a terminal unit 1412. The circuit board 1410 may include the throughhole 1411 through which light, having passed through the lens module,passes. The circuit board 1410 may include the terminal unit 1412, whichis bent downwards and is exposed to the outside. The terminal unit 1412may be exposed at at least part thereof to the outside, and may beconnected to an external power source, whereby power is supplied to thecircuit board 1410.

The OIS coil unit 1420 may move the drive magnet unit 1320 viaelectromagnetic interaction. The OIS coil unit 1420 may be positioned atthe circuit board 1410. The OIS coil unit 1420 may be positioned betweenthe base 1500 and the housing 1310. The OIS coil unit 1420 may face thedrive magnet unit 1320. When power is applied to the OIS coil unit, thedrive magnet unit 1320 and the housing 1310, to which the drive magnetunit 1320 is fixed, may be moved together via interaction between theOIS coil unit 1420 and the drive magnet unit 1320.

The OIS coil unit 1420 may be constituted by a fine pattern coil (FPcoil), which is mounted on the circuit board 1410. This may be efficientin terms of miniaturization of the lens moving apparatus (decrease inthe height of the lens moving apparatus in the optical-axis direction,i.e., in the Z-axis direction). For examples, the OIS coil unit 1420 maybe disposed so as to minimize interference with the OIS sensor unit1720, which is positioned thereunder. The OIS coil unit 1420 may bepositioned so as not to overlap the OIS sensor unit 1720 in anup-and-down direction.

The OIS coil unit 1420 may include the through hole 1421, through whichlight, having passed through the lens module, passes. The through hole1421 may have a diameter corresponding to the diameter of the lensmodule. The through hole 1421 in the OIS coil unit 1420 may have adiameter corresponding to that of the through hole 1411 in the circuitboard 1410. The through hole 1421 in the OIS coil unit 1420 may have adiameter corresponding to that of the through hole in the base 1500. Forexample, the through hole 1421 may be circular, without being limitedthereto.

The base 1500 may be positioned under the bobbin 1210. The base 1500 maybe positioned under the housing 1310. The base 1500 may support thesecond movable unit 1300. A printed circuit board may be positionedunder the base 1500. The base may serve as a sensor holder adapted tofunction to protect the image sensor mounted on the printed circuitboard.

The base 1500 may include a through hole 1510, a contaminant collector1520 and a sensor mount 1530.

The base 1500 may include the through hole 1510, which is formed at aposition that corresponds to the lens-accommodating portion 1211 in thebobbin 1210. An infrared ray filter may be coupled to the through hole1510 in the base 1500. Alternatively, the infrared ray filter may alsobe coupled to an additional sensor holder disposed under the base 1500.

The base 1500 may include the contaminant collector 1520 for collectingcontaminants, which are introduced into the cover member 1100. Thecontaminant collector 1520 may be positioned on the upper surface of thebase 1500, and may include an adhesive material so as to collectcontaminants in the internal space defined by the cover member 1100 andthe base 1500.

The base 1500 may include the sensor mount 1530, to which the OIS sensorunit 1720 is coupled. In other words, the OIS sensor unit 1720 may bemounted on the sensor mount 1530. Here, the OIS sensor unit 1720 maydetect the drive magnet unit 1320 coupled to the housing 1310 so as todetect horizontal movement or tilting of the housing 1310. For example,the sensor mount 1530 may include two sensor mounts. Each of the twosensor mounts 1530 may be configured to have a groove shape, and may beprovided with the OIS sensor unit 1720. In this case, the OIS sensorunit 1720 may include a first axis sensor and a second axis sensor,which are disposed so as to detect movement of the housing 1310 both inthe X-axis and Y-axis directions.

The elastic support member 600 may connect two or more of the firstmovable unit 1200, the second movable unit 1300, the stationary unit1400 and the base 1500 to each other. The elastic support member 1600may elastically connect two or more of the first movable unit 1200, thesecond movable unit 1300, the stationary unit 1400 and the base 1500 toeach other so as to support the components while allowing the componentsto move relatively to one another. The elastic support member 600 may beformed so as to have elasticity at at least part thereof. In this case,the elastic support member 600 may be referred to as an elastic memberor a spring.

For example, the elastic support member 600 may include the upperelastic member 1610, the lower elastic member 1620 and the supportmember 1630. Here, the upper elastic member 1610 and the lower elasticmember 1620 may be referred to as a ‘spring for autofocus’, an ‘elasticmember for autofocus’, a ‘spring’ or the like. The support member 1630may be referred to as a ‘spring for handshake correction’, an ‘elasticmember for OIS’ or the like.

The upper elastic member 1610 may be coupled both to an upper portion ofthe housing and to an upper portion of the bobbin 1210. The first innerframe 1612 of the upper elastic member 1610 may be coupled to the uppercoupling portion 1213 of the bobbin 1210, and the first outer frame 1611of the upper elastic member 1610 may be coupled to the upper couplingportion 1313 of the housing 1310. At least part of the upper elasticmember 1610 may be positioned between the upper stopper 1340 and theprotrusion 1330.

The upper elastic member 1610 may include the first outer frame 1611,the first inner frame 1612, a coupling portion 1613, a first connectingportion 1614 and a second connecting portion 1615.

The upper elastic member 1610 may include the first inner frame 1612,which is coupled to the bobbin 1210. The upper elastic member 1610 mayinclude the first outer frame 1611, which is coupled to the housing1310. The upper elastic member 1610 may include the coupling portion1613, which is coupled to the support member 1630. The upper elasticmember 1610 may include the first connecting portion 1614, whichconnects the first inner frame 1612 to the first outer frame 1611. Theupper elastic member 1610 may include the second connecting portion1615, which connects the first outer frame 1611 to the coupling portion1613.

The first outer frame 1611 may be coupled to the housing 1310. The firstinner frame 1612 may be coupled to the bobbin 1210. The coupling portion1613 may be coupled to the support member 1630. The first damper may bepositioned at the coupling portion 1613. The first coupling portion 1614may connect the first inner frame 1612 to the first outer frame 1611.The second connecting portion 1615 may connect the first outer frame1611 to the coupling portion 1613. The second connecting portion 1615may be bent multiple times.

For example, the upper elastic member 1610 may be divided into a pair ofmembers so as to supply power to the AF coil unit 1220. The upperelastic member 1610 may include the first upper elastic member 1616 andthe second upper elastic member 1617, which are spaced apart from eachother. The first upper elastic member 1616 may be conductively connectedto one end of the AF coil unit 1220, and the second upper elastic member1617 may be conductively connected to the other end of the AF coil unit1220. By virtue of this configuration, the upper elastic member 1610 isable to supply power to the AF coil unit. The upper elastic member 1610may be supplied with power from the circuit board 1410 via the supportmember 1630.

The upper elastic member 1610 may include a fusion groove 1618. Thefusion groove 1618 may be formed in the first outer frame 1611. Thefusion groove 1618 may extend from the hole into which the protrusion ofthe housing 1310 is fitted. By virtue of this configuration, when theprotrusion of the housing 1310 is fused by heat in the state in whichthe protrusion of the housing 1310 is fitted into the hole in the upperelastic member 1610, part of the fused protrusion is introduced into thefusion groove 1618, thereby preventing rotation of the first outer frame1611.

The lower elastic member 1620 may be coupled both to a lower portion ofthe bobbin 1210 and to a lower portion of the housing 1310. The lowerelastic member 1620 may include the second outer frame 1621, the secondinner frame 1622 and a connecting portion 1623. The lower elastic member1620 may include the second outer frame 1621, coupled to the housing1310, the second inner frame 1622, coupled to the bobbin 1210, and theconnecting portion 1623, elastically connecting the second outer frame1621 to the second inner frame 1622. For example, the lower elasticmember 1620 may be integrally formed, without being limited thereto. Ina modification, the lower elastic member 1620 may be divided into a pairof members so as to supply power to the AF coil unit 1220 and the like.

The support member 1630 may elastically support the housing 1310 withrespect to the base 1500. The support member 1310 may be coupled at oneend thereof to the stationary unit 1400 and/or the base 1500, and may becoupled at the other end thereof to the upper elastic member 1610 and/orthe housing 1310. The support member 1630 may be coupled to thestationary unit 1400 and to the upper elastic member 1610. The supportmember 1630 may be coupled at one end thereof to the stationary unit1400, and may be coupled at the other end thereof to the upper elasticmember 1610. By virtue of this configuration, the support elasticallysupports the second movable unit 1300 with respect to the stationaryunit 1400 such that the second movable unit 1300 is moved horizontallyor tilted. For example, the support member 1630 may include a pluralityof wires. In a modification, the support member 1630 may include aplurality of leaf springs. The support member 1630 may be integrallyformed with the upper elastic member 1610.

The support member 1630 may be conductively connected at one end thereofto the circuit board 1410, and may be conductively connected at theother end thereof to the upper elastic member 1610. For example, thesupport member 1630 may include four support members. In other words,the support member 1630 may include first to fourth support members 1631to 1634, which are disposed so as to be spaced apart from one another.

The support member 1630 may include the first support member 1631,positioned at the first corner portion 1305 of the housing 1310. Thesupport member 1630 may include the second support member 1632,positioned at the second corner portion 1306 of the housing 1310. Thesupport member 1630 may include the third support member 1633,positioned at the third corner portion 1307 of the housing 1310. Thesupport member 1630 may include the fourth support member 1634,positioned at the fourth corner portion 1308 of the housing 1310. Inother words, the first to fourth support members 1631 to 1634 may becontinuously disposed so as to be adjacent to each other. However, thenumber of support members 1630 is not limited to four.

The support member 1630 or the upper elastic member 1610 may include ashock-absorbing portion (not shown) for absorbing shocks. Theshock-absorbing portion may be provided at one or more of the supportmember 1630 and the upper elastic member 1610. The shock-absorbingportion may be a separate member, such as a damper. Alternatively, theshock-absorbing portion may be realized by partial change of the shapeof one or more of the support member 1630 and the upper elastic member1610.

The sensor unit may be provided for one or more of autofocus feedbackand handshake correction feedback. The sensor unit may detect theposition or movement of one or more of the first movable unit 1200 andthe second movable unit 1300.

For example, the sensor unit may include the AF sensor unit and the OISsensor unit 1720. The AF sensor unit may detect relative verticalmovement of the bobbin 1210 with respect to the housing 1310 so as toprovide information for AF feedback. The OIS sensor unit 1720 may detecthorizontal movement or tilting of the second movable unit 1300 so as toprovide information for OIS feedback.

For example, the AF sensor unit may include an AF sensor (not shown), asensor circuit board (not shown) and a sensing magnet (not shown). TheAF sensor may be disposed at an upper portion of the housing 1310. Here,the sensing magnet may be disposed at an upper portion of the bobbin1210. The AF sensor may be disposed at the housing 1310 in the state ofbeing mounted on the sensor circuit board. The AF sensor may detect theposition or movement of the bobbin 1210 by detecting the sensing magnetdisposed at the bobbin 1210. The AF sensor may be a Hall sensor adaptedto detect the magnetic force of the sensing magnet, without beinglimited thereto.

The OIS sensor unit 1720 may be positioned at the stationary unit 1400.The OIS sensor unit 1720 may be positioned on the upper or lower surfaceof the circuit board 1410. For example, the OIS sensor unit 1720 may bedisposed on the lower surface of the circuit board 1410, and may bepositioned on the sensor mount 1530 formed on the base 1500. Forexample, the OIS sensor unit 1720 may include a Hall sensor. In thiscase, the OIS sensor unit may detect relative movement of the secondmovable unit 1300 with respect to the stationary unit 1400 by detectinga magnetic field of the drive magnet unit 1320. For example, the OISsensor unit 1720 may include a first axis sensor and a second axissensor so as to detect the movement of the second movable unit 1300 bothin both the X-axis and Y-axis directions. The OIS sensor unit 1720 maybe positioned so as not to overlap the FP coil of the OIS coil unit 1420in the up-and-down direction.

The first damper (not shown) may be applied to the support member 1630.The first damper may be positioned at one or more of the couplingportion 1613, the support member 1630 and the housing 1310. By virtue ofthis configuration, the first damper is able to prevent a resonancephenomenon (oscillation phenomenon at the resonant frequency) of theelastic support member 1600, which may occur in the OIS feedbackprocedure. Here, the first damper may be positioned inside theprotrusion 1330 of the housing 1310. In this case, since a phenomenon inwhich the first damper is separated outwards is prevented, it ispossible to more efficiently manage the first damper.

The second damper (not shown) may be positioned at the protrusion 1215of the bobbin 1210 and the first inner frame 1612 of the upper elasticmember 1610. By virtue of this configuration, the first damper is ableto prevent a resonance phenomenon of resonance of the elastic supportmember 1600, which may occur in AF feedback and/or OIS feedbackprocedure.

Hereinafter, the autofocus function of the camera module including thelens moving apparatus according to an embodiment will be described. Whenpower is supplied to the AF coil unit 1220, the AF coil unit 1220 ismoved with respect to the drive magnet unit 1320 via electromagneticinteraction between the AF coil unit 1220 and the drive magnet unit1320. Here, the bobbin 1210, to which the AF coil unit 1220 is coupled,is moved together with the AF coil unit 1220. In other words, the bobbin1210, which is provided therein with the lens module, is moved in theoptical-axis direction (in the up-and-down direction or in the verticaldirection) with respect to the housing 1310. Since the movement of thebobbin 1210 causes the lens module to be moved close to or away from theimage sensor, the embodiment is able to perform control of focus on anobject by supplying power to the AF coil unit 1220.

For the purpose of more precise realization of an autofocus function,autofocus feedback may be applied to the embodiment. The AF sensor,which is disposed at the housing 1310 and is embodied as a Hall sensor,detects a magnetic field of the sensing magnet secured to the bobbin1210. Accordingly, as the bobbin 1210 is moved relative to the housing1310, the amount of the magnetic field that is detected by the AFsensor, varies. The AF sensor detects an amount of movement or positionof the bobbin 1210 in the Z-axis direction using the above principle,and transmits the detected value to the controller. The controllerdetermines whether or not further movement of the bobbin 1210 isperformed based on the detected value. Since this procedure is performedin real time, it is possible to perform a more precise autofocusfunction of the camera module according to the embodiment by means ofthe autofocus feedback.

The function of handshake correction of the camera module including thelens moving apparatus according to the embodiment will be described.When power is supplied to the OIS coil unit 1420, the drive magnet unit1320 is moved with respect to the OIS coil unit 1420 via electromagneticinteraction between the OIS coil unit 1420 and the drive magnet unit1320. At this time, the housing 1310, to which the drive magnet unit1320 is coupled, is moved together with the drive magnet unit 1320. Inother words, the housing 1310 is moved horizontally with respect to thebase 1500. However, the housing 1310 may be tilted with respect to thebase 1500. The bobbin 1210 is moved together with the housing 1310.Accordingly, since the movement of the housing 1310 causes the lensmodule to be moved with respect to the image sensor in a directionparallel to the direction in which the image sensor is disposed(perpendicular to the optical-axis, i.e., a horizontal direction), theembodiment is able to perform the function of handshake correction bysupplying power to the OIS coil unit 1420.

For the purpose of more precise realization of the function of handshakecorrection, handshake correction feedback may be applied to theembodiment. The OIS sensor unit 1720 composed of a pair of OIS sensorunits, which are mounted on the base 1500 and are embodied as Hallsensors, detects a magnetic field of the drive magnet unit 1320 securedto the housing 1310. Accordingly, as the housing 1310 moves relative tothe base 1500, the amount of the magnetic field that is detected by theOIS sensor unit 1720 varies. The pair of OIS sensor units 1700 detectsan amount of movement or position of the housing 1310 in the horizontaldirection (in the X-axis and Y-axis directions) using the aboveprinciple, and transmits the detected value to the controller. Thecontroller determines whether or not further movement of the housing1310 is performed based on the detected value. Since this procedure isperformed in real time, it is possible to perform a more precisehandshake correction function of the camera module according to theembodiment by means of the handshake correction feedback.

FIG. 23 is a perspective view showing part of a lens moving apparatusaccording to a further embodiment. FIG. 23 may be a modification of theembodiment shown in FIGS. 18 to 22.

Referring to FIG. 23, the lens moving apparatus may include the covermember 1100, the first movable unit 1200, the second movable unit 1300,the stationary unit 1400, the base 1500, the elastic support member 1600and the sensor unit (not shown). Here, a description regarding the covermember 1100, the first movable unit 1200, the second movable unit 1300,the stationary unit 1500, the elastic support member 1600 and the sensorunit (not shown) may be replaced with the description regarding thoseshown FIGS. 18 to 21. The difference between the modification and theprevious embodiment resides in the shape of the housing 1310 of thesecond movable unit 1300 and the number of support members 1630 of theelastic support member 600.

The housing 1310 according to the embodiment may include the steppedportion 1360, projecting from the side surface of the housing thatdefines the support member recess 1350. The stepped portion 1360 mayproject from the side surface of the housing 1310 that defines thesupport member recess 1350. In other words, the stepped portion 1360 maybe formed in a partial region of the support member recess 1350 so as toreduce the diameter of the support member recess 1350. The steppedportion 1360 may prevent the first damper from being separated downwardsalong the support member recess 1350. In other words, the steppedportion 1360 may serve as a structure for prevention of separation ofthe damper.

The modification may include eight support members 1630, which arespaced apart or separated from each other. In the modification, each ofthe support member recess 1350 adapted to accommodate the support member1630 and the upper elastic member 1610 coupled to the support member1630 may be divided into eight parts.

FIG. 24 is an exploded perspective view illustrating a camera module 200according to an embodiment.

Referring to FIG. 24, the camera module may include a lens module 400,the lens moving apparatus, an adhesive member 710, a filter 610, a firstholder 600, a second holder 800, an image sensor 810, a motion sensor820, a controller 830, and a connector 840.

The lens module 400 may include a lens or may include a lens and a lensbarrel. The lens module 400 may be mounted in the bobbin 110 of the lensmoving apparatus.

The configuration of the lens module 400 is not limited to a lensbarrel, and the lens module 400 may have any other configuration as longas the lens module can support one or more lenses. For example, the lensmodule 400 may be coupled to the inside of the lens moving apparatus.For example, the lens module may be coupled to the lens moving apparatusin a threaded manner. For example, the lens module may be coupled to thelens moving apparatus via an adhesive (not shown). The light that haspassed through the lens module 400 may be radiated to the image sensor810.

The first holder 600 may be located under the base 210 of the lensmoving apparatus. The filter 610 may be mounted on the first holder 600,and the first holder 600 may have a raised portion 500 on which thefilter 610 is seated.

The adhesive member 710 may couple or attach the base 210 of the lensmoving apparatus to the first holder 600. In addition to the attachmentfunction described above, the adhesive member 710 may serve to preventcontaminants from entering the lens moving apparatus.

The adhesive member 710 may be, for example, epoxy, thermohardeningadhesive, ultraviolet hardening adhesive or the like.

The filter 610 may serve to prevent light within a specific frequencyband, having passed through the lens module 400, from being introducedinto the image sensor 810. The filter 610 may be aninfrared-light-blocking filter, without being limited thereto. Here, thefilter 610 may be oriented parallel to the X-Y plane.

The region of the first holder 600 in which the filter 610 is mountedmay be provided with a bore so as to allow the light that passes throughthe filter 610 to be introduced into the image sensor 810.

The second holder 800 may be disposed under the first holder 600, andthe image sensor 810 may be mounted on the second holder 800. The lightthat passes through the filter 610 is introduced into the image sensor810 so as to form an image on the image sensor 810.

The second holder 800 may include, for example, various circuits,devices, and a controller in order to convert the image, formed on theimage sensor 810, into electrical signals and to transmit the electricalsignals to an external component.

The second holder 800 may be embodied as a circuit board on which theimage sensor may be mounted, a circuit pattern may be formed, andvarious devices may be coupled.

The image sensor 810 may receive an image contained in the lightintroduced through the lens moving apparatus, and may convert thereceived image into electrical signals. The image sensor 810 may outputradiated light as an image. The image sensor 810 may be, for example, acharge-coupled device (CCD), a metal oxide semiconductor (MOS), CPD orCID. However, the kind of the image sensor is not limited thereto.

The filter 610 and the image sensor 810 may be spaced apart from eachother so as to be opposite to each other in the first direction.

The motion sensor 820 may be mounted on the second holder 800, and maybe conductively connected to the controller 830 through the circuitpattern formed on the second holder 800.

The motion sensor 820 outputs rotational angular speed informationregarding the movement of the camera module 200. The motion sensor 820may be embodied as a dual-axis or triple-axis gyro sensor or an angularspeed sensor.

The controller 830 may be mounted on the second holder 800, and may beconductively connected to the second position sensor 240 and the secondcoil 230 of the lens moving apparatus. For example, the second holder800 may be conductively connected to the circuit board 250 of the lensmoving apparatus, and the controller 820 mounted on the second holder800 may be conductively connected to the second position sensor 240 andthe second coil 230 through the circuit board 250.

For example, the controller 820 may supply drive signals to the firstcoil 120 and the second coil 230, may supply drive signals to the firstposition sensor 170 and the second position sensor 240, and may receiveoutput signals from the first position sensor 170 and the secondposition sensor 240.

For example, the handshake controller 830 may output a drive signal,which is required in order to allow the lens moving apparatus to performAF feedback driving for the AF movable unit and/or handshake feedbackcorrection for the OIS movable unit, based on output signals providedfrom the second position sensor 240 of the lens moving apparatus.

The connector 840 may be conductively connected to the second holder800, and may have a port for electrical connection of an externalcomponent.

The lens moving apparatus 100 according to the embodiment may beembedded in an optical instrument, which is intended to form an image ofan object in a space so as to increase a user's visual perception usingreflection, refraction, absorption, interference, diffraction and thelike, which are properties of light, which is intended to record animage formed through a lens and to reproduce the image, or which isintended to perform optical measurement, propagation or transmission ofan image or the like. For example, the optical instrument according tothe embodiment may be any one of a mobile phone, a smartphone, aportable smart device, a digital camera, a laptop computer, a digitalbroadcasting terminal, a Personal Digital Assistant (PDA), a PortableMultimedia Player (PMP), and a navigation tablet PC, but is not limitedhereto. Any kind of device for capturing an image or a photograph may bepossible.

FIG. 25 is a perspective view illustrating a portable terminal 200Aaccording to an embodiment. FIG. 26 is a view illustrating theconfiguration of the portable terminal illustrated in FIG. 25.

Referring to FIGS. 25 and 26, the portable terminal 200A (hereinafterreferred to as a “terminal”) may include a body 850, a wirelesscommunication unit 710, an audio/video (A/V) input unit 720, a sensingunit 740, an input/output unit 750, a memory unit 760, an interface unit770, a controller 780, and a power supply unit 790.

The body 850 illustrated in FIG. 25 has a bar shape, without beinglimited thereto, and may be any of various types such as, for example, aslide type, a folder type, a swing type, or a swivel type, in which twoor more sub-bodies are coupled so as to be movable relative to eachother.

The body 850 may include a case (e.g. casing, housing, or cover)defining the external appearance of the terminal. For example, the body850 may be divided into a front case 851 and a rear case 852. A varietyof electronic components of the terminal may be mounted in the spacedefined between the front case 851 and the rear case 852.

The wireless communication unit 710 may include one or more modules,which enable wireless communication between the terminal 200A and awireless communication system or between the terminal 200A and a networkin which the terminal 200A is located. For example, the wirelesscommunication unit 710 may include a broadcast reception module 711, amobile communication module 712, a wireless Internet module 713, anearfield communication module 714, and a location information module715.

The A/V input unit 720 serves to input audio signals or video signals,and may include, for example, a camera 721 and a microphone 722.

The camera 721 may be the camera 200 including the lens moving apparatus100 according to the embodiment illustrated in FIG. 18.

The sensing unit 740 may sense the current state of the terminal 200A,such as, for example, the opening or closing of the terminal 200A, thelocation of the terminal 200A, the presence of a user's touch, theorientation of the terminal 200A, or the acceleration/deceleration ofthe terminal 200A, and may generate a sensing signal to control theoperation of the terminal 200A. For example, when the terminal 200A is aslide-type phone, the sensing unit 740 may detect whether the slide-typephone is open or closed. In addition, the sensing unit 740 serves tosense, for example, whether power is supplied from the power supply unit790, or whether the interface unit 770 is coupled to an externalcomponent.

The input/output unit 750 serves to generate, for example, visual,audible, or tactile input or output. The input/output unit 750 maygenerate input data to control the operation of the terminal 200A, andmay display information processed in the terminal 200A.

The input/output unit 750 may include a keypad unit 730, a displaymodule 751, a sound output module 752, and a touch screen panel 753. Thekeypad unit 730 may generate input data in response to input to akeypad.

The display module 751 may include a plurality of pixels, the color ofwhich varies in response to electrical signals. For example, the displaymodule 751 may include at least one of a liquid crystal display, a thinfilm transistor liquid crystal display, an organic light emitting diodedisplay, a flexible display and a 3D display.

The sound output module 752 may output audio data received from thewireless communication unit 710 in, for example, a call-signal-receivingmode, a call mode, a recording mode, a voice recognition mode, or abroadcast receiving mode, or may output audio data stored in the memoryunit 760.

The touch screen panel 753 may convert variation in capacitance, causedby a user's touch on a specific region of a touch screen, intoelectrical input signals.

The memory unit 760 may store programs for the processing and control ofthe controller 780, and may temporarily store input/output data (e.g. aphone book, messages, audio, still images, pictures, and moving images).For example, the memory unit 760 may store images captured by the camera721, for example, pictures or moving images.

The interface unit 770 serves as a passage for connection between theterminal 200A and an external component. The interface unit 770 mayreceive power or data from the external component, and may transmit thesame to respective constituent elements inside the terminal 200A, or maytransmit data inside the terminal 200A to the external component. Forexample, the interface unit 770 may include, for example, awired/wireless headset port, an external charger port, a wired/wirelessdata port, a memory card port, a port for the connection of a devicehaving an identification module, an audio input/output (I/O) port, avideo I/O port, and an earphone port.

The controller 780 may control the general operation of the terminal200A. For example, the controller 780 may perform control and processingrelated to, for example, voice calls, data communication, and videocalls.

The controller 780 may include a multimedia module 781 for multimediaplayback. The multimedia module 781 may be provided inside thecontroller 780, or may be provided separately from the controller 780.

The controller 780 may perform pattern recognition processing, by whichwriting or drawing input to a touch screen is perceived as charactersand images, respectively.

The power supply unit 790 may supply power required to operate therespective constituent elements upon receiving external power orinternal power under the control of the controller 780.

The features, configurations, effects and the like described above inthe embodiments are included in at least one embodiment, but are notnecessarily limited to only one embodiment. In addition, the features,configuration, effects and the like exemplified in the respectiveembodiments may be combined with other embodiments or modified by thoseskilled in the art. Accordingly, content related to these combinationsand modifications should be construed as falling within the scope of theembodiments.

INDUSTRIAL APPLICABILITY

The embodiments may be applied to a lens moving apparatus, which iscapable of reducing the influence of induction magnetic field of an OIScoil on an OIS position sensor and of ensuring stability of OIS feedbackcontrol and reliability of handshake correction, and to a camera moduleand an optical device each including the same.

The invention claimed is:
 1. A lens moving apparatus, comprising: a housing; a bobbin disposed in the housing; a first coil unit disposed at the bobbin; a magnet disposed at the housing and facing the first coil unit; an upper elastic member coupled to an upper portion of the bobbin and an upper portion of the housing; a circuit board disposed under the housing; a second coil unit disposed on the circuit board and facing the magnet; and a support member electrically connecting the upper elastic member and the circuit board, wherein the housing comprises a protrusion extending upwards from an upper surface thereof, and the protrusion is positioned farther from a center of the housing than the support member when viewed from a top.
 2. The lens moving apparatus according to claim 1, wherein the upper elastic member comprises an outer frame coupled to the upper portion of the housing, a coupling portion coupled to one end of the support member, and a connecting portion connecting the outer frame and the coupling portion, and wherein the protrusion is positioned farther from the center of the housing than the coupling portion when viewed from the top.
 3. The lens moving apparatus according to claim 1, wherein the housing comprises a stopper extending from the upper surface thereof, and the protrusion is positioned outside the stopper.
 4. The lens moving apparatus according to claim 3, wherein an upper surface of the protrusion is positioned to be lower than an upper surface of the stopper and be higher than the upper elastic member.
 5. The lens moving apparatus according to claim 3, wherein the coupling portion is positioned between the stopper and the protrusion.
 6. The lens moving apparatus according to claim 1, wherein the housing comprises a recess depressed from an outer side thereof to accommodate a portion of the support member.
 7. The lens moving apparatus according to claim 3, wherein the housing comprises a side portion and a corner portion, and the protrusion and the stopper are positioned at the corner portion.
 8. The lens moving apparatus according to claim 1, comprising a cover member configured to accommodate the housing and the bobbin in an internal space thereof, wherein the cover member comprises a top plate, a side plate, and a round portion connecting the top plate and the side plate, and wherein the protrusion overlaps the round portion of the cover member in an optical axis direction.
 9. The lens moving apparatus according to claim 1, comprising a damper disposed on the coupling portion and the support member.
 10. The lens moving apparatus according to claim 1, wherein the housing comprises four corner portions and four protrusions corresponding to four corners thereof, wherein support member comprises two support members disposed at one of the four corners of the housing, and wherein one of the four protrusions corresponds to the two support members.
 11. The lens moving apparatus according to claim 2, wherein the protrusion overlaps the coupling portion and the connecting portion in a direction perpendicular to an optical axis.
 12. The lens moving apparatus according to claim 6, wherein the recess of the housing comprises a first region and a second region disposed under the first region, and a stepped portion is formed in the second region of the recess, and wherein a size of the second region in a direction perpendicular to an optical axis direction is smaller than a size of the first region.
 13. The lens moving apparatus according to claim 2, wherein the connecting portion comprises a bent portion and the protrusion is positioned farther from the center of the housing than the connecting portion.
 14. The lens moving apparatus according to claim 1, comprising: a base disposed under the circuit board; and a first sensor unit disposed between the base and the circuit board and electrically connected to the circuit board.
 15. The lens moving apparatus according to claim 14, comprising: a sensing magnet disposed on the bobbin; and a second sensor unit disposed on the housing and configured to detect a magnetic force of the sensing magnet.
 16. A lens moving apparatus, comprising: a housing comprising a protrusion extending upwards from an upper surface thereof; a bobbin disposed in the housing; a first coil unit disposed at the bobbin; a magnet disposed at the housing and facing the first coil unit; and an upper elastic member comprising an outer frame coupled to the upper portion of the housing; a circuit board disposed under the housing; a second coil unit disposed on the circuit board and facing the magnet; and a support member electrically connecting the upper elastic member and the circuit board, wherein the upper elastic member comprises: a coupling portion coupled to one end of the support member; and a connecting portion connecting the outer frame and the coupling portion, and wherein a distance between a center of the housing and the protrusion is greater than a distance between the center of the housing and the coupling portion of the upper elastic member when viewed from a top.
 17. The lens moving apparatus according to claim 16, comprising a damper disposed on at least one of the coupling portion and the support member.
 18. The lens moving apparatus according to claim 17, wherein a distance between the center of the housing and the damper is smaller than a distance between the center of the housing and the protrusion.
 19. A lens moving apparatus, comprising: a housing comprising a side portion and a corner portion; a bobbin disposed in in the housing; a first coil unit disposed at the bobbin; a magnet disposed at the housing and facing the first coil unit; an upper elastic member coupled to the upper portion of the housing; a circuit board disposed under the housing; a second coil unit disposed on the circuit board and facing the magnet; and a support member comprising one end coupled to the upper elastic member and electrically connecting the upper elastic member and the circuit board, wherein the housing comprises a protrusion extending upwards from an upper surface of the corner portion, and an upper surface of the protrusion is positioned to be higher than the upper elastic member, and wherein the protrusion is positioned at outside of the support member and the outside of the support member is opposite to an inside of the support member on which a center of the housing is located when viewed from a top.
 20. A camera module, comprising: a lens; a lens moving apparatus according to claim 1; and an image sensor. 